2005
DOI: 10.1117/12.601010
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An investigation of a new generation of progressive mask defects on the pattern side of advanced photomasks

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Cited by 2 publications
(3 citation statements)
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“…Since the introduction of optical lithography with deep ultraviolet (DUV) of 193 nm, photo-activated defect formation on a photomask (PM) has become a considerable concern in the semiconductor industry. [1][2][3][4] It is expected to be more serious when an extreme-UV (EUV) technique emerges in the near future owing to the much higher photon energy. 5) The PM is composed of many components or materials such as quartz, chrome film, a pellicle, a pellicle frame, and adhesives.…”
Section: Introductionmentioning
confidence: 99%
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“…Since the introduction of optical lithography with deep ultraviolet (DUV) of 193 nm, photo-activated defect formation on a photomask (PM) has become a considerable concern in the semiconductor industry. [1][2][3][4] It is expected to be more serious when an extreme-UV (EUV) technique emerges in the near future owing to the much higher photon energy. 5) The PM is composed of many components or materials such as quartz, chrome film, a pellicle, a pellicle frame, and adhesives.…”
Section: Introductionmentioning
confidence: 99%
“…When a contaminant layer or crystal, known as haze, is formed on the surface of a PM by photoreaction, the transmittance of the PM will decrease to disturb the patterning. [1][2][3][4] Here, the pellicle is a thin, transparent polymer membrane mounted on a PM to protect its patterned surface from airborne particulates. Thus far, not much attention has been paid to the pellicle itself as long as a high transmission is guaranteed.…”
Section: Introductionmentioning
confidence: 99%
“…The most commonly detected contaminants are ammonium sulfate, ammonium oxalate, cyanuric acid, hydrocarbons, and organo-silicon compounds. 2 Figure 2 shows the typical levels of contaminants often found on photomasks and optical elements. We obtained these results using time-of-flight secondaryion mass spectroscopy (ToF-SIMS).…”
mentioning
confidence: 99%