An introduction of QFN-SIP package: Process challenges and technical issues

How, Lee Chee; Choh, Thong Kai; Guan, Lim Ken

doi:10.1109/iemt.2008.5507792

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) 2008

DOI: 10.1109/iemt.2008.5507792

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An introduction of QFN-SIP package: Process challenges and technical issues

Lee Chee How¹,

Thong Kai Choh²,

Lim Ken Guan³

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2012

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Challenges in solder on leadframe packages

Khuen

Choh

2012

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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Power device application is one of the highest growth sectors in today's semiconductor technology. The main applications for power devices are switches or rectifiers used in servers, desktops, notebook, cell phone etc. From a packaging perspective, power devices are characterised by its ability and efficiency in conducting high current. To conduct high current, a power package must have low electrical resistance and good thermal dissipation system. As such, applying solder as interconnect between the die and the leadframe or cu clips to mosfets is by far the best solution for thermal dissipation and electrical conductivity. This is because solder poses superior thermal conductivity performance (approximate 3 times better than high thermal conductive epoxy & approximate 10 times lower in terms of volume resistivity). In the industry today, typical power package that applies conductive epoxy handles about 2~16A current while package applies solder capable to handles 25~60A current. As such, solder will continue to be the preferred material over epoxy for power packages that requires high current. This paper will discuss on the challenges faced when using solder as the die attach material on leadframe based packages.

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Challenges in solder on leadframe packages

Khuen

Choh

2012

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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show abstract

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An introduction of QFN-SIP package: Process challenges and technical issues

Cited by 1 publication

References 1 publication

Challenges in solder on leadframe packages

Challenges in solder on leadframe packages

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