An integrated system for design automation of VLSI interconnects and packaging

Abstract

The packaging design support environment (PDSE) is a software system being developed at the University of Arizona to facilitate the analysis and design of packaging structures for microelectronic integrated circuits, a subject which is becoming one of increasing iruportance with higher circuit integration and system perfor1nanc.e. PDSE provides a platform for work in several active research areas including interconnect and packaging modeling and simulation in electrical, thermal, and thermal-mechanical aspects, ('AD framework development and evaluations for performance, riianufacturability, and reliability, etc. This paper describes the overall architecture and characteristics of the PDSE system in development, its implementation and applications.