An insight into ultrasonic vibration assisted conventional manufacturing processes: A comprehensive review

The 7075 aluminum alloy deep hole pipe finds extensive applications in the aerospace industry due to its remarkable attributes, such as high strength, exceptional wear resistance, and favorable mechanical properties. However, traditional boring processes for 7075 aluminum alloy deep hole pipes tend to generate elevated cutting forces, potentially leading to deformation issues in these deep holes. In response to these challenges, this study introduces a novel approach involving the use of a two-dimensional ultrasonic elliptical vibration tool. This tool features a single excitation asymmetric structure and aims to enhance the deep hole machining process in 7075 aluminum alloy. The research methodology involved several key steps. First, theoretical analysis and simulation were performed to study the motion trajectory of the cutting edge of the tool. Second, practical experiments were conducted comparing two-dimensional ultrasonic elliptical vibration boring with conventional boring for 7075 aluminum alloy deep hole pipes. The results demonstrate that, in contrast to conventional boring, two-dimensional ultrasonic vibration boring could achieve a maximum reduction of 54.1% and an average reduction of 50.4% in the roundness value of the deep holes. The impact of machining parameters on deep hole roundness is assessed through experimental analysis, leading to the determination of optimal processing parameters. In summary, this experimental research has a certain reference significance for the application of 7075 aluminum alloy deep hole parts in the aerospace field.

Section: Analysis Of Roundness Orthogonal Test Resultsmentioning

confidence: 96%

Section: Introductionmentioning

confidence: 99%

Experimental Study on the Roundness of Deep Holes in 7075 Aluminum Alloy Parts by Two-Dimensional Ultrasonic Elliptical Vibration Boring

Yang,

Tong,

Liu

et al. 2023

“…Ultrasonic vibration-assisted DWS (UV-DWS) is a composite processing technology that combines ultrasonic vibration with fixed abrasive DWS [ 153 ]. The ultrasonic vibration-assisted machining process makes it possible to cut a variety of hard materials with conventional diamond [ 154 ]. Ultrasonic-assisted vibration has been widely used in numerous manufacturing processes to improve process performance [ 155 ].…”

Section: Hybrid Machiningmentioning

confidence: 99%

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Zhou³

et al. 2023

Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production yield of the cutting process, it is necessary to have a thorough understanding of the phenomena relating to the cutting parameters. This research reviews and summarizes the technology for the precision machining of monocrystalline silicon using diamond wire sawing (DWS). Firstly, mathematical models, molecular dynamics (MD), the finite element method (FEM), and other methods used for studying the principle of DWS are compared. Secondly, the equipment used for DWS is reviewed, the influences of the direction and magnitude of the cutting force on the material removal rate (MRR) are analyzed, and the improvement of silicon wafer surface quality through optimizing process parameters is summarized. Thirdly, the principles and processing performances of three assisted machining methods, namely ultrasonic vibration-assisted DWS (UV-DWS), electrical discharge vibration-assisted DWS (ED-DWS), and electrochemical-assisted DWS (EC-DWS), are reviewed separately. Finally, the prospects for the precision machining of monocrystalline silicon using DWS are provided, highlighting its significant potential for future development and improvement.

“…In the ultrasonic-vibration-assisted cutting process, the tool and workpiece periodically separate. The continuous cutting process becomes an intermittent cutting process and helps to reduce both the cutting force and tool wear [12,13]. The ultrasonic vibration equipment and ultrasonic-vibration-assisted cutting mechanisms and equipment include one-dimensional vibrations and multidimensional vibrations, and they have been widely studied by scholars worldwide.…”

Section: Introductionmentioning

confidence: 99%

Magnetic-Field-Assisted Scratching Process of Single-Crystal Copper

Wu,

Zhang,

Sun

et al. 2023

Energy-field-assisted cutting exhibits excellent ability to reduce cutting force and improve machining quality. In this study, a magnetic field was applied in an innovative way to aid in the cutting process, and magnetic-field-assisted scratching experiments of single-crystal copper were carried out. It was found that magnetic-field-assisted scratching increased the actual scratching force due to the additional Lorentz force in the cutting process. However, the friction coefficient of the magnetic-field-assisted scratching was reduced by 19.4% due to the tribological modification effect on tool/chip contact. Meanwhile, magnetic-field-assisted scratching was conducive to decreasing the degree of chip deformation, reducing microburrs on the machined surface, and obtaining a surface roughness reduction of an average of 26.8%. The possible reason for this effect was that the presence of a magnetic field in the cutting process promoted the dislocation slip of metal materials. The results indicated that magnetic-field-assisted cutting improves the machinability in the metal cutting process.