2010
DOI: 10.1016/j.solmat.2009.06.001
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An innovative process suitable to produce high-efficiency CdTe/CdS thin-film modules

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Cited by 126 publications
(62 citation statements)
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“…The methods used to deposit CdTe thin films include sputtering [6], thermal evaporation [7], metal-organic chemical vapour deposition (MOCVD) [8], molecular beam epitaxy (MBE) [9], close space sublimation (CSS) [10], electrodeposition [11] etc. Among the techniques mentioned above, electrodeposition offers the best solution for simplicity and lowcost in order to deposit various types of semiconductors [12].…”
Section: Introductionmentioning
confidence: 99%
“…The methods used to deposit CdTe thin films include sputtering [6], thermal evaporation [7], metal-organic chemical vapour deposition (MOCVD) [8], molecular beam epitaxy (MBE) [9], close space sublimation (CSS) [10], electrodeposition [11] etc. Among the techniques mentioned above, electrodeposition offers the best solution for simplicity and lowcost in order to deposit various types of semiconductors [12].…”
Section: Introductionmentioning
confidence: 99%
“…CdS is an important semiconductor compound of the II-VI group with excellent physical properties and band gap energy of 2.42 eV. It has been extensively studied due to its potential application in field effect transistor, lightemitting diodes, photocatalysis, biological sensors, solar cells and photodegradation of water pollutants (Alivisatos 1996;Colvin et al 1994;Klein et al 1997;Ruxandra and Antohe 1998;Romeo et al 2010;Beecroft and Ober 1997). The electronic properties of CdS nanoparticles doped with transition metals are strongly influenced by the doped transition metals (Liu Kewei et al 2007).…”
Section: Introductionmentioning
confidence: 99%
“…До осадження мiдi зазвичай проводять хiмiчне травлення поверхнi -CdTe, щоб збагатити її телу-ром, який реагуючи з Cu, формує сполуку Cu Te (1≤ ≤ 2) [31]. Сполука Cu Te також виконує функцiю буферного шару, що запобiгає дифузiї мi-дi по границях зерен в матрицю CdTe i далi до мi-сця гетеропереходу.…”
Section: виготовлення омIчного контактуunclassified
“…Дифузiя мiдi створює дорiж-ки шунтування, що знижує термiн експлуатацiї СЕ [3]. З iншого боку, дифузiя мiдi безпосередньо в шарi CdTe знижує його опiр i, тим самим, збiль-шує ефективнiсть СЕ [31]. Бiльшiсть дослiдникiв роблять контакт на CdTe -типу з використанням Cu-мiстких сполук, таких як Cu-Au шари, Cu 2 Te, ZnTe : Cu або Cu 2 S [3].…”
Section: виготовлення омIчного контактуunclassified