An Innovative Heterogeneous SoC Thermal Model for Smartphone System

Kuo, Sheng-Liang; Pan, Chunxu; Huang, Pei-Yu; Fang, Chien-Tse; Hsiau, Shin-Yu; Chen, Taiyu

doi:10.1109/itherm.2018.8419605

Cited by 7 publications

(2 citation statements)

References 9 publications

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“…The proposed model is based on linear system theory [11]. Linearity (aka superposition principle) is a customary and reasonably accurate approximation for thermal models of processor chips [8,12].…”

Section: Single-input Single-output Modelmentioning

confidence: 99%

Exploiting Thermal Transients With Deterministic Turbo Clock Frequency

Michaud

2020

IEEE Comput. Arch. Lett.

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Modern microprocessors feature turbo mechanisms that adjust the clock frequency dynamically so as to maximize processor performance under power and temperature limits. However, the documentation for commercial chips rarely provides more than a superficial description of how turbo works. This paper highlights certains aspects of turbo that are not well known outside the industry and that distinguish it from dynamic thermal management. A plausible open-source turbo is proposed and described, extrapolating from the scarce and sparse information that has been disclosed so far.

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Section: Single-input Single-output Modelmentioning

confidence: 99%

Exploiting Thermal Transients With Deterministic Turbo Clock Frequency

Michaud

2020

IEEE Comput. Arch. Lett.

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“…The early design stages for smartphones include thermal‐aware designs for package/die [13] and smartphones [14]. Moreover, the thermal distributions/maps of smartphones can help estimate the transient power budget [15]. And the thermal distributions/maps of die/package/smartphones are needed for these stages.…”

Section: Introductionmentioning

confidence: 99%

Phone‐nomenon 2.0: A compact thermal model for smartphones

Lee

Chiou

Shiau

et al. 2023

IET Computers & Digital Tech

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This paper presents a compact thermal model for smartphones, Phone‐nomenon 2.0, to predict the thermal behavior of smartphones. In the beginning, non‐linearities of internal and external heat transfer mechanisms of smartphones and a compact thermal model for these non‐linearities have been studied and proposed. Then, an iterative simulation procedure to handle these non‐linearities was developed, and the basic simulation framework which is one option in Phone‐nomenon 2.0 was established and we call it Phone‐nomenon.Iter. Finally, the linearisation approach was applied, and model order reduction techniques to enhance and speed up the basic framework were employed, and these two options Phone‐nomenon.Lin and Phone‐nomenon.LinMOR were named. Compared with a commercial tool, ANSYS Icepak, Phone‐nomenon.Iter can achieve two orders of magnitude speedup with the maximum error being less than 1.90% for steady‐state simulations and three orders of magnitude speedup with the temperature difference being less than 0.65°C for transient simulations. In addition, the speedup of Phone‐nomenon.Lin over Phone‐nomenon.Iter can be at least 4.22× and 3.26× for steady‐state and transient simulations, respectively. Moreover, the speedup of Phone‐nomenon.LinMOR over Phone‐nomenon.Lin is at least 2.57×.

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