2015
DOI: 10.1109/led.2015.2437716
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An Innovative Ellipsoidal Layout Style to Further Boost the Electrical Performance of MOSFETs

Abstract: This paper describes the impact of using a new gate geometry (ellipsoidal) rather than the standard one (rectangular) to implement planar Metal-Oxide-Semiconductor (MOS) Field Effect Transistors (MOSFETs). Our experimental results have been carried out using a 350 nm Bulk Complementary MOS (CMOS) technology node. We show that the proposed layout has been capable of increasing the on-state and saturation drain currents in 2 and 3.2 times, respectively. Additionally, the ellipsoidal MOSFET has been able to reduc… Show more

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Cited by 27 publications
(19 citation statements)
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“…This can be proven by reference [28], which has shown that the gate capacitance of an ellipsoidal layout style for MOSFET (EM) is around 11% greater than the one found in its conventional MOSFET (CM) counterpart in room temperature, because its PN junctions length between the drain/source and channel regions are higher, considering both devices with the same W and bias conditions. However, the RON of the EM is 65% remarkably smaller than that those found in its CM counterpart, and therefore, the τ of the EM is significantly smaller (61%) than the one observed in its CM counterpart in room temperature [28].…”
Section: On-state Resistancementioning
confidence: 97%
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“…This can be proven by reference [28], which has shown that the gate capacitance of an ellipsoidal layout style for MOSFET (EM) is around 11% greater than the one found in its conventional MOSFET (CM) counterpart in room temperature, because its PN junctions length between the drain/source and channel regions are higher, considering both devices with the same W and bias conditions. However, the RON of the EM is 65% remarkably smaller than that those found in its CM counterpart, and therefore, the τ of the EM is significantly smaller (61%) than the one observed in its CM counterpart in room temperature [28].…”
Section: On-state Resistancementioning
confidence: 97%
“…The gain provided by the octagonal layout style for MOSFET in RON are also discussed in the following references regarding numerical simulations and experimental results in room temperature [24,25] and radiation environment [40,41]. Making an analogy with the study of reference [28], it possible to predict that the delay time constant (τ = RON.CGS, which CGS is gate capacitance) of the OSM tends to be smaller than the one found in its RSM counterpart, regarding that both devices present the same W, and bias conditions. This can be proven by reference [28], which has shown that the gate capacitance of an ellipsoidal layout style for MOSFET (EM) is around 11% greater than the one found in its conventional MOSFET (CM) counterpart in room temperature, because its PN junctions length between the drain/source and channel regions are higher, considering both devices with the same W and bias conditions.…”
Section: On-state Resistancementioning
confidence: 99%
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“…Deve-se ressaltar que uma possível alternativa para a implementação de MOSFETs, que não adiciona qualquer custo para o atual processo de fabricação de CIs CMOS, é a denominada de "Engenharia de Junção PN entre as regiões de Dreno-Canal e Canal-Fonte do MOSFET", que se refere ao uso de novos e diferentes estilos de leiautes de porta para a implementação de transistores que possuem formatos de porta não retangulares, ou seja, diferentemente dos MOSFETs convencionais [20]. Alguns exemplos dessas estruturas de leiaute não convencionais de porta são: SOI MOSFETs de porta em formato de Anel Circular (CGSMs) [21], [22], MOSFETs do tipo Wave (formato de porta semelhante a letra "S") [23], [24], [25] do tipo Fish [26], [27], do tipo Diamante [28], [29], do tipo Octogonal [30] e do tipo elipsoidal [31].…”
Section: 212 Introduçãounclassified
“…Dessa forma, ao aumentar a velocidade média de deriva dos portadores móveis do canal ( = * ⃗ // , sendo v a velocidade média de deriva dos portadores do canal, μ a mobilidade dos portadores móveis porta retangular de diferentes comprimentos de canal e com larguras de canal infinitesimais. Assim sendo, a corrente entre dreno e fonte tende a fluir mais pelas bordas do dispositivo, onde existem os MOSFETs com menores comprimentos de canal[13][29][30]. Correspondente circuito elétrico equivalente de um DM.…”
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