An improved optical cantilever technique using image processing for measuring in situ stress in thin films

Moulard, G.; Contoux, G.; Gardet, G.; Motyl, Guy; Courbon, M.

doi:10.1016/s0257-8972(97)00190-4

Cited by 9 publications

(2 citation statements)

References 8 publications

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“…This simplified version of Stoney's equation requires only the elastic properties of the substrate. The properties of the Au film and the electrodeposit can be ignored if the combined thickness is less than 5 % of the substrate thickness [10]. We have thus limited our experiments to deposit thicknesses less than 1 mm.…”

Section: Methodsmentioning

confidence: 99%

In Situ Stress Measurements During Copper Deposition

Stafford¹,

Beauchamp²,

Kongstein

2007

ECS Trans.

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In situ stress measurements were made during copper electrodeposition onto (111)-textured Au from acidic sulfate electrolyte using the wafer curvature method. During the bulk deposition of Cu, there is a rapid increase in tensile stress during the first 20 nm of growth that we attribute to nuclei coalescence and grain boundary formation. The magnitude of the tensile stress as well as the film thickness at which the maximum stress occurs are both dependent upon the electrode potential due to its influence on the nucleation density. As the deposit thickens, the average film stress decreases rather quickly and can become compressive in deposits formed at small deposition overpotentials. Both of these observations are consistent with stress-generation models proposed in the literature. When deposition is interrupted, both tensile and compressive components of the stress relax but are quickly reestablished when deposition is resumed, suggesting that the relaxation is reversible and not due to irreversible microstructural changes.

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Section: Methodsmentioning

confidence: 99%

In Situ Stress Measurements During Copper Deposition

Stafford¹,

Beauchamp²,

Kongstein

2007

ECS Trans.

View full text Add to dashboard Cite

show abstract

“…Among them X-ray diffraction method [4][5][6], interferometry [7] method, Newton's ring [8] methods are common. But the bending method is now well known for its simplicity, versatility and accuracy [9,10]. In this method the bending of film-substrate system is measured and stress is calculated by Stoney's formula.…”

Section: Introductionmentioning

confidence: 99%