2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017)
DOI: 10.1109/mwsym.2000.863289
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An improved deep sub-micron MOSFET RF nonlinear model with new breakdown current model and drain to substrate nonlinear coupling

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Cited by 5 publications
(3 citation statements)
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“…Since the minimum feature size of complementary metaloxide-semiconductor (CMOS) devices has been scaled down to the nanoscale regime, the radio-frequency (RF) performance of silicon (Si) metal-oxide-semiconductor field-effect transistors (MOSFETs) has markedly improved, [1][2][3][4][5][6][7][8][9][10][11][12] and is now comparable to that of compound semiconductor transistors based on GaAs and GaN. [13][14][15][16][17][18][19] Recently, a compact model and a parameter extraction method have been developed intensively for Si RF MOSFETs.…”
Section: Introductionmentioning
confidence: 99%
“…Since the minimum feature size of complementary metaloxide-semiconductor (CMOS) devices has been scaled down to the nanoscale regime, the radio-frequency (RF) performance of silicon (Si) metal-oxide-semiconductor field-effect transistors (MOSFETs) has markedly improved, [1][2][3][4][5][6][7][8][9][10][11][12] and is now comparable to that of compound semiconductor transistors based on GaAs and GaN. [13][14][15][16][17][18][19] Recently, a compact model and a parameter extraction method have been developed intensively for Si RF MOSFETs.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4][5][6][7] Over the past decades, however, the minimum feature size of complementary metal-oxide-semiconductor (CMOS) devices has been continuously reduced and the high-frequency performance of MOS transistors has been markedly improved. [8][9][10][11][12][13][14][15][16][17] To apply metal-oxide-semiconductor field-effect transistors (MOSFETs) to the RF circuit design, an accurate compact model and a good parameter extraction method for highly scaled RF MOSFETs should be developed preferentially. [18][19][20][21][22][23][24] In this regard, substrate resistance components are very important parameters in the RF IC design since they have a large influence on the output admittance of RF MOSFET.…”
Section: Introductionmentioning
confidence: 99%
“…The breakdown voltage has also been experimentally found to depend upon RF conditions. It has been observed that under large-signal high-frequency conditions, devices can be driven beyond their DC breakdown limits [19,20]. The breakdown voltage under RF conditions is higher than that under DC conditions, thus implying that the maximum output power can be greater under RF excitation.…”
Section: Introductionmentioning
confidence: 99%