An Improved Area Efficient 16-QAM Transceiver Design using Vedic Multiplier for Wireless Applications

Dhanasekar, S.; Bruntha, P. Malin; Madhuvappan, C. Arunkumar; Sagayam, K. Martin

doi:10.35940/ijrte.c5535.098319

Cited by 18 publications

(3 citation statements)

References 3 publications

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“…If the sub-threshold swing of a device is small, then the leakage current, power dissipation and the threshold voltage of a device will also occur quite low [18]. Field Programmable Gate Array (FPGA) provides more flexible, accurate in simulating, testing and gives end to end solutions for reprogramming the proposed designs in the hardware [19].…”

Section: Sub-threshold Swingmentioning

confidence: 99%

An Ultra-low-power Static Random-Access Memory Cell Using Tunneling Field Effect Transistor

Arunkumar¹,

Senathipathi²,

Dhanasekar³

et al. 2020

IJE

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In this research article, an Ultra-low-power 1-bit SRAM cell is introduced using Tunneling Field Effect Transistor (TFET). This paper investigates feasible 6T SRAM configurations on improved N-type and P-type TFETs integrated on both InAs (Homojunction) and GaSb-InAs (Heterojunction) platforms. The voltage transfer characteristics and basic parameters of both Homo and Heterojunctions are examined and compared. The proposed TFET based SRAM enhances the stability in the hold, read, and write operations. This work evaluates the potential of TFET which can replace MOSFET due to the improved performance with low-power consumption, high speed, low sub-threshold slope, and supply voltage (VDD = 0.2 V). The results are correlated with CMOS 32nm technology. The proposed SRAM TFET cell is implemented using 30nm technology and simulated using an H-SPICE simulator with the help of Verilog-A models. The proposed SRAM TFET cell architecture achieves low power dissipation and attains high performance as compared to the CMOS and FINFET.

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Section: Sub-threshold Swingmentioning

confidence: 99%

An Ultra-low-power Static Random-Access Memory Cell Using Tunneling Field Effect Transistor

Arunkumar¹,

Senathipathi²,

Dhanasekar³

et al. 2020

IJE

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“…Composite material structures have attracted interest for various industrial applications based on their ability to improve their strength-to-weight proportion when analyzed with non-reinforced materials [1]. Digitalization will encompass the majority of engineering fields, with a bigger impact over wide-area communication networks involving fast data transmission [2][3][4]. A significant amount of research has been expended and recounted over various reviews in the field of machining composites [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

A Comprehensive Study of Ceramic Matrix Composites for Space Applications

Dhanasekar¹,

Ganesan²,

Rani

et al. 2022

Advances in Materials Science and Engineering

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Ceramic matrix composites (CMCs) have grown in popularity as a material for a range of high as well as protection components, increasing the need to better understand the impacts of multiple machining methods. It is primarily composed of ceramic fibers embedded in the matrix. Ceramic materials, especially carbon fibers and carbon were used to create the matrix and fibers. These ceramics include a huge variety of non-metallic inorganic materials that are regularly utilized under high temperatures. The aircraft industry became revolutionized by this unique combination of materials, which made parts better resistant under extreme conditions as well as lighter than the earlier technology. The development, properties, and production of ceramic matrix composites, as well as space applications, are discussed in this article. Ceramic materials have an interesting set of properties, including great strength and stiffness under extremely high temperatures, chemical inertness, low density, etc. In CMC, ceramics are used in the matrix as well as reinforcement. The matrix material keeps things running smoothly while the reinforcement delivers unique special properties. Ceramic matrix composites are developed for applications that required high thermal and mechanical characteristics, which include nuclear power plants, aircraft, chemical plants, space structures, and transportation services. Even though advanced aircraft relies on high-performance propulsion systems, improving the total impulses over the total mass ratio for rocket engines becomes essential for improving their performance that demands reduced engine structural weight as well as higher component heat resistance. The evolution of new ultra-high-temperature composites having high-temperature resistance as well as low density that a substitute super alloy and refractory metal material has become so essential and laid the foundation for high-performance engine design. The benefits of continuous fiber- reinforced CMC with high-temperature engine designs have long been recognized as a better measure of a country’s ability to design and produce spacecraft, modern aircraft, and weapons. Ceramic matrix composites materials are used in various aircraft type engines, aircraft brake disks, high-temperature gas turbines components, slide bearing components, hot gas duct, flame holders and components for burners are made by using oxide CMCs.

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“…The majority of engineering disciplines will be engrossed by digitalization, which will have a greater effect on broad wireless communication with high-speed data transfer [2][3][4]. Due to the huge differences in property requirements between the two classes of composites, their design criteria for electronic and structural composites were distinct.…”

Section: Introductionmentioning

confidence: 99%

Study of Polymer Matrix Composites for Electronics Applications

Dhanasekar¹,

Stella²,

Thenmozhi³

et al. 2022

Journal of Nanomaterials

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Polymer matrix composites (PMCs) may be found in nearly every facet of modern society, from electronic components to a broad range of accessories. Polymer matrix composites contain materials that include a matrix polymer. It is also made up of multiple continuous and short fibres that are held together in the organic polymer matrix. In this article, the development, properties, and production of polymer matrix composites along with electronics applications were discussed. The matrices in recent developments of polymer matrix composites have been made of thermosets or thermoplastic materials. The properties of a PMC such as a matrix and reinforcement offer great strength and rigidity, and it is largely employed to increase fracture toughness. The process of manufacturing composites has a significant impact on the product design and outcome. The ability to make a product from a variety of manufacturing techniques is unique to the composites industry. Polymer-based materials were employed in a variety of applications, including the automobile industry, aircraft industry, marine, sports good equipment, electronics applications, and biomedical applications. The great potential of filler reinforced polymer composites used for microelectronic applications. Woven glass fibre cloths and reinforcing materials such as paper, glass fibre matte, and fillers are used to fabricate printed circuit boards. Thermoplastics and thermosets are used in electronic packaging material which increases efficiency and offers more stringent requirements. Polymer composites have good thermal conductivity and desirable dielectric properties which improves microelectronic performances. Nanocomposites are composites in which nanofillers were distributed inside a polymer. The compatibility and interface between the filler and matrix play a significant effect in modifying overall characteristics in polymer nanocomposites.

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An Improved Area Efficient 16-QAM Transceiver Design using Vedic Multiplier for Wireless Applications

Cited by 18 publications

References 3 publications

An Ultra-low-power Static Random-Access Memory Cell Using Tunneling Field Effect Transistor

An Ultra-low-power Static Random-Access Memory Cell Using Tunneling Field Effect Transistor

A Comprehensive Study of Ceramic Matrix Composites for Space Applications

Study of Polymer Matrix Composites for Electronics Applications

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