2018
DOI: 10.1016/j.applthermaleng.2017.12.066
|View full text |Cite
|
Sign up to set email alerts
|

An experimental study of enhanced heat sinks for thermal management using n-eicosane as phase change material

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
23
0

Year Published

2019
2019
2023
2023

Publication Types

Select...
8

Relationship

3
5

Authors

Journals

citations
Cited by 126 publications
(24 citation statements)
references
References 54 publications
0
23
0
Order By: Relevance
“…To enhance the heat transfer enhancement and TES performance of organic PCMs, some strategies such as encapsulation [1] and shape-stabilization [2] have been carried out. There are several thermal conductive materials (TCMs) which have been embedded with PCMs to overcome their low thermal conductivity such as metal-fins [3,4,5,6,7,8,9], metal-foam [10], carbon additives [11,12,13,14], metallic and metal oxides nanoparticles [13,15,16,17,14].…”
Section: Introductionmentioning
confidence: 99%
“…To enhance the heat transfer enhancement and TES performance of organic PCMs, some strategies such as encapsulation [1] and shape-stabilization [2] have been carried out. There are several thermal conductive materials (TCMs) which have been embedded with PCMs to overcome their low thermal conductivity such as metal-fins [3,4,5,6,7,8,9], metal-foam [10], carbon additives [11,12,13,14], metallic and metal oxides nanoparticles [13,15,16,17,14].…”
Section: Introductionmentioning
confidence: 99%
“…Recently, Arshad et al 36 have numerically studied the transient behavior of a finned PCM‐based heat sink for electronics cooling purposes. This study was a continuation of previous experimental work by the same authors 37 . Metal fins of a thickness of 2 and 3 mm were inserted into the PCM‐based heat sink.…”
Section: Application Of Pcm In the Thermal Management Of Electronic Cmentioning
confidence: 88%
“…Thus, a PCM with higher latent-heat and thermal conductivity with stable chemical structure is the most suitable. To overcome this issue, researchers have introduced several heat transfer enhancement techniques including extruded metal-fins [12,13,14,15,16,17], metal-foam and porous materials [18,19], nanomaterials [20,21,22] encapsulated micro/nano-capsules [23,24,25,26].…”
Section: Introductionmentioning
confidence: 99%