An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity

Lee, S.-W. Ricky; Yan, Changyu; Chow, Lung; Papageorge, M.

doi:10.1109/eptc.1997.723890

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307)

DOI: 10.1109/eptc.1997.723890

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An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity

S.-W. Ricky Lee

Changyu Yan²,

Lung Chow³

et al.

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An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity

Cited by 0 publications

References 2 publications

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