“…Accordingly, some smoothing procedures have been employed to increase the clearance and smoothness of the initial path, as in [45,56]. Also, minimizing the number of orientation changes of the assembler in the process of assembly can reduce the complexity of manipulation [38,51,57]. Another objective functions that is specific to the DAPP problem is maximizing the distance of a disassembled part from the remaining subassembly, as mentioned in [40,58,59].…”