An efficient inter-frame coding with intra skip decision in H.264/AVC

Kim, Myounghoon; Jung, Seung-Won; Sull, Sanghoon

doi:10.1109/tce.2010.5506012

Cited by 9 publications

(11 citation statements)

References 11 publications

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“…The maximum stress that the beam receives should not exceed the yield strength of the material. From the equation for cantilevers, 25,26) if the width of the beam decreases, the thickness of the beam must decrease proportionally. When the width is greater than or the same as the thickness, the beam can stably move in the top-down direction; at the same time, the beam length will decrease.…”

Section: Designmentioning

confidence: 99%

Design and Fabrication of Microelectromechanical Systems Probe Card with Vertical Trench Guide for Fine Pitch Probing

Kim¹,

Cho

Lee

et al. 2012

Jpn. J. Appl. Phys.

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In this study, we developed a new microelectromechanical systems (MEMS) probe card with a vertically guided and electroplated cantilever in order to overcome pitch limitation, which has a compliant structure and is capable of a 35 µm pad pitch, with through-wafer interconnections for IC testing. We also investigated the reliability of the MEMS probe card using tribology and scaling of the MEMS probe card for fine pitch probing. The measured contact resistance was less than 0.5 Ω at 1.5 gf applied force and the leakage current was approximately 10 pA between one tip and an adjacent tip. In addition, the planarity of tips and the alignment of x- and y-axes were satisfied with a conventional needle probe card performance. Therefore, this probe card is suitable for wafer-level burn-in testing and function testing of memory and RF devices.

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Section: Designmentioning

confidence: 99%

Design and Fabrication of Microelectromechanical Systems Probe Card with Vertical Trench Guide for Fine Pitch Probing

Kim¹,

Cho

Lee

et al. 2012

Jpn. J. Appl. Phys.

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“…The test video sequences shown in Figure 5 with 640x480 pixel resolution, 25Hz and different classes of motion activities supported by MERL are employed in the simulations. Table III gives the simulation environments strictly based on the MVC common test conditions described in [14]. Since the target of our works is to establish a fast and high quality MD algorithm for JMVM, the RD performance (video quality and compression efficiency) and the processing time are the two main performances to be evaluated in our experiments.…”

Section: Performance Evaluationsmentioning

confidence: 99%

Intelligent Mode Decision Procedure for MVC Inter-view Frame

Liu

Sohn

Yang

et al. 2010

2010 13th IEEE International Conference on Computational Science and Engineering

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In this paper, an intelligent low-cost mode decision (MD) procedure is proposed for the inter-view frame of the multi-view video coding (MVC). Multiple parameters, such as macroblock (MB) energy, view/temporal domain mode similarities and so on, are utilized to reduce the number of the mode candidates so that the corresponding Rate-to-Distortion Cost (RDCost) computing can be eliminated. The simulation results show that the proposed algorithm can reduce more than 90% processing time for the inter-view frame compared with the original JMVM codec with only a slight quality loss which can be ignored. It can be widely employed by the multiview signal communications especially under the mobile and embedded environments.

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Section: Introductionmentioning

confidence: 99%

“…In common MEMS probe card fabrication processes, thick photoresists (PRs) such as dry film resist and THB 151N [1][2][3][4][24][25][26] are used. In order to form the pyramidal tip, silicon wet etchants such as potassium hydroxide (KOH) and tetramethylammonium hydroxide (TMAH) [1][2][3][4][24][25][26] are also included. In this study, we investigated the properties of eutectic solders, such as the chemical resistance in PR developer solutions and in wet etching solutions, and the bondability of the MEMS probe card.…”

Section: Introductionmentioning

confidence: 99%

Eutectic Solder Bonding for Highly Manufacturable Microelectromechanical Systems Probe Card

Kim

2011

Jpn. J. Appl. Phys.

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We developed eutectic solder bonding for the microelectromechanical systems (MEMS) probe card. We tested various eutectic solder materials, such as Sn, AgSn, and AuSn, and investigated the bonding ability of Sn-based multi-element alloys and their resistance to chemical solutions. The Sn-based alloys were formed by sputtering, electroplating, and the use of solder paste. According to our experimental results, Sn-rich solders, such as Ag3.5Sn, Ag3.5Sn96Cu0.5, and Sn, were severely damaged by silicon wet etchant such as potassium hydroxide (KOH) and tetramethylammonium hydroxide (TMAH). On the other hand Au80Sn20 was resistant to those chemicals. In order to verify the joint bondability of the solders, we used a cantilever probe beam, and bump which were made of nickel and nickel alloy. After flip-chip bonding of the cantilever beam and the bump with Au80Sn20 solder paste, we measured the contact force to verify the mechanical strength. We then re-inspected it with X-rays and found no voids in the joint.

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An efficient inter-frame coding with intra skip decision in H.264/AVC

Cited by 9 publications

References 11 publications

Design and Fabrication of Microelectromechanical Systems Probe Card with Vertical Trench Guide for Fine Pitch Probing

Design and Fabrication of Microelectromechanical Systems Probe Card with Vertical Trench Guide for Fine Pitch Probing

Intelligent Mode Decision Procedure for MVC Inter-view Frame

Eutectic Solder Bonding for Highly Manufacturable Microelectromechanical Systems Probe Card

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