An effective method of evaluating the device-level thermophysical properties and performance of micro-thermoelectric coolers

Sun, Dongfang; Shen, Limei; Sun, Ming; Yu, Yao; Chen, Huanxin; Jin, Shiping

doi:10.1016/j.apenergy.2018.03.027

Cited by 21 publications

(5 citation statements)

References 27 publications

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“…Thus, today the COP of thermoelectric cooling devices is below 1 . Therefore, its use is limited to niche applications, particularly in miniaturized systems . Compared to elastocaloric cooing, Peltier‐based cooling has already reached a high level of maturity.…”

Section: Engineering Of Sma Film‐based Cooling Devicesmentioning

confidence: 99%

“…[73,74,76] Therefore,i ts use is limited to niche applications, [73,74] particularly in miniaturizeds ystems. [77][78][79] Compared to elastocaloric cooing,P eltier-basedc ooling has already reached ah igh level of maturity.T he technology does not require any moving parts.A lthough the fabricationo ft hermoelectric modules can be complex, [79] the integration of the module into ac ooling device is rather simple.T hermoelectric coolers can be operated continuously and reach high temperature differences.T oday,m ost thermoelectric materials comprise rare elements and critical substances such as lead. [73,74] The development of new thermoelectric materials with higher ZT values based on abundant and environmentally friendly elements will be importantt oa dvance the field of thermoelectrics.…”

Section: Other Solid-state Coolingdevices On the Miniature Scalementioning

confidence: 99%

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Elastocaloric Cooling on the Miniature Scale: A Review on Materials and Device Engineering

Bruederlin

Bumke²,

Chluba³

et al. 2018

Energy Tech

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This Review covers the fundamentals of operation and scaling of elastocaloric cooling devices as well as current developments of elastocaloric shape‐memory alloy (SMA) films and the engineering of SMA film‐based cooling devices. Sputter‐deposited TiNiCuCo alloys showing ultra‐low fatigue enable unique functional properties such as tailored transformation temperature gradients. Two substantially different concepts for the development of elastocaloric cooling demonstrators are discussed. One concept relies on heat transfer by mechanical contact between the elastocaloric SMA film and solid heat sink and source elements. The second concept makes use of the heat transfer between the elastocaloric SMA film and a heat transfer fluid, including the advanced technology of active regeneration. Demonstrators based on a single SMA film reach device temperature spans of 14 K and a high specific cooling power of up to 18 W g−1. The performance characteristics are compared with other solid‐state caloric cooling technologies.

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Section: Engineering Of Sma Film‐based Cooling Devicesmentioning

confidence: 99%

Section: Other Solid-state Coolingdevices On the Miniature Scalementioning

confidence: 99%

Elastocaloric Cooling on the Miniature Scale: A Review on Materials and Device Engineering

Bruederlin

Bumke²,

Chluba³

et al. 2018

Energy Tech

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“…To quantitatively analyze the effects of TEiMs on the performance of thin film TECs, an accurate simulation model was built in COMSOL based on an effective method that considered boundary and size effects and was validated in our previous work. 25 The electrical contact resistivities are in Tables 2 and 3. The geometric structure and other details of the model are listed in the Supporting Information.…”

Section: Methodsmentioning

confidence: 99%

Optimization of Interface Materials between Bi₂Te₃-Based Films and Cu Electrodes Enables a High Performance Thin-Film Thermoelectric Cooler

Shen

Chen

Niu

et al. 2022

ACS Appl. Mater. Interfaces

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Thermoelectric interface materials (TEiMs) are key to optimizing the electrical contact and stability of the interface between thermoelectric material and metal electrode in high-performance thin-film thermoelectric coolers (TECs). Herein, we explored TEiMs applicable to representative Bi–Te films and found that Cr and Ag are effective TEiMs for p-type Bi0.5Sb1.5Te3 and n-type Bi2Te3, respectively. By introducing 200 nm Cr and 200 nm Ag as TEiMs for p-type Bi0.5Sb1.5Te3/Cu and n-type Bi2Te3/Cu interfaces, Cu diffusion is suppressed, and excellent electrical contact is achieved (1.81 × 10–12 Ω m2 for p-type and 3.32 × 10–12 Ω m2 for n-type) and remains stable after heat treatment (2.37 × 10–12 Ω m2 for p-type and 1.63 × 10–12 Ω m2 for n-type). Furthermore, the cooling flux of TECs with optimized TEiMs increases from 122.74 to 296.56 W/cm2, while the performance degradation caused by contact resistance decreases from 50.81 to 4.15%. In addition, our results show that diffusion occurs between not only Cu but also Ag and the thermoelectric material, as TEiMs diffuse slightly. The diffusion of Cu and Ag at the interface can optimize the electrical contact of Bi2Te3/Cu but strongly degrade the electrical contacts of Bi0.5Sb1.5Te3/Cu. Our work provides an optimal selection of TEiMs for high-performance Bi–Te thin film coolers and provides guidance for further miniaturization of devices.

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“…Due to the unique temperature distribution inside the holey silicon substrate, by adjusting the doping concentration to obtain a larger Thomson coefficient, the cooling of the Thomson effect could be comparable to that of Peltier cooling, significantly improving transient overcooling, prolonging the duration of subcooling temperature, and significantly mitigating temperature overshooting after transient pulsed currents. Sun et al [33] developed a method based on the coupled Boltzmann equation and the Wiedemann-Franz (W-F) law, and built a 3D numerical model to evaluate the device-level properties and performance of micro-TECs at various interfaces (e.g., contacts, boundaries) and dimensional effects, and assessed the collective impact of electronic and phonon boundary resistances, the boundary Seebeck effect, and the dimensional effect on the TE at the device level. It was found that both boundary and size effects weakened the figure of merit of thermoelectric materials at the device level and that the larger the heat flux, the greater the influence of boundary effects.…”

Section: Introductionmentioning

confidence: 99%

The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure

Ming,

Liu,

Zhang

et al. 2023

Energies

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Thermoelectric cooling is an ideal solution for chip heat dissipation due to its characteristics of no refrigerant, no vibration, no moving parts, and easy integration. Compared with a traditional thermoelectric device, a thin-film thermoelectric device significantly improves the cooling density and has tremendous advantages in the temperature control of electronic devices with high-power pulses. In this paper, the transient cooling performance of a compact thin-film thermoelectric cooler with a horizontal structure was studied. A 3D multi-physics field numerical model with the Thomson effect considered was established. And the effects of impulse current, thermoelectric leg length, pulse current imposition time, and the size of the contact thermal resistance on the cooling performance of the device were comprehensively investigated. The results showed that the model achieved an active cooling temperature difference of 25.85 K when an impulse current of 0.26 A was imposed. The longer the length of the thermoelectric leg was, the more unfavorable it was to the chip heat dissipation. Due to the small contact area between different sections of the device, the effect of contact thermal resistance on the cooling performance of the device was moderate.

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An effective method of evaluating the device-level thermophysical properties and performance of micro-thermoelectric coolers

Cited by 21 publications

References 27 publications

Elastocaloric Cooling on the Miniature Scale: A Review on Materials and Device Engineering

Elastocaloric Cooling on the Miniature Scale: A Review on Materials and Device Engineering

Optimization of Interface Materials between Bi₂Te₃-Based Films and Cu Electrodes Enables a High Performance Thin-Film Thermoelectric Cooler

The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure

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An effective method of evaluating the device-level thermophysical properties and performance of micro-thermoelectric coolers

Cited by 21 publications

References 27 publications

Elastocaloric Cooling on the Miniature Scale: A Review on Materials and Device Engineering

Elastocaloric Cooling on the Miniature Scale: A Review on Materials and Device Engineering

Optimization of Interface Materials between Bi2Te3-Based Films and Cu Electrodes Enables a High Performance Thin-Film Thermoelectric Cooler

The Transient Cooling Performance of a Compact Thin-Film Thermoelectric Cooler with Horizontal Structure

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Optimization of Interface Materials between Bi₂Te₃-Based Films and Cu Electrodes Enables a High Performance Thin-Film Thermoelectric Cooler