Abstract:Recently, device reliability has been an important issue since the design rule is scaled down and complicated processing is involved. To improve the reliability, many problems should be solved. One of the problems in interconnection failure is short or open circuits at interconnection lines. Contact or via hole failure has been ignored while the metal line failure has been strongly studied by many researchers.In this study, electromigration (EM) phenomena at the submicron size of contact hole are presented wit… Show more
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