“…IEC 61967-4 describes another method for measuring the conducted electromagnetic emission (EME) of ICs by using a 1Ω resistive probe to measure RF current and a 150Ω coupling network to measure RF voltage [36].The workbench faraday cage is another technique for conducting RF immunity and emission quantifications in a small space without the need for large anechoic chamber [37]. Magnetic probe method is another standard for emission measurement [38]. It specifies a procedure for measuring RF currents on the pins of an IC using a miniature magnetic probe and non-contact current calculation [39].…”
Section: Measurement Methods For Emc Predictionmentioning
The proper function of the integrated circuit (IC) in an inhibiting electromagnetic environment has always been a serious concern throughout the decades of revolution in the world of electronics, from disjunct devices to today’s integrated circuit technology, where billions of transistors are combined on a single chip. The automotive industry and smart vehicles in particular, are confronting design issues such as being prone to electromagnetic interference (EMI). Electronic control devices calculate incorrect outputs because of EMI and sensors give misleading values which can prove fatal in case of automotives. In this paper, the authors have non exhaustively tried to review research work concerned with the investigation of EMI in ICs and prediction of this EMI using various modelling methodologies and measurement setups.
“…IEC 61967-4 describes another method for measuring the conducted electromagnetic emission (EME) of ICs by using a 1Ω resistive probe to measure RF current and a 150Ω coupling network to measure RF voltage [36].The workbench faraday cage is another technique for conducting RF immunity and emission quantifications in a small space without the need for large anechoic chamber [37]. Magnetic probe method is another standard for emission measurement [38]. It specifies a procedure for measuring RF currents on the pins of an IC using a miniature magnetic probe and non-contact current calculation [39].…”
Section: Measurement Methods For Emc Predictionmentioning
The proper function of the integrated circuit (IC) in an inhibiting electromagnetic environment has always been a serious concern throughout the decades of revolution in the world of electronics, from disjunct devices to today’s integrated circuit technology, where billions of transistors are combined on a single chip. The automotive industry and smart vehicles in particular, are confronting design issues such as being prone to electromagnetic interference (EMI). Electronic control devices calculate incorrect outputs because of EMI and sensors give misleading values which can prove fatal in case of automotives. In this paper, the authors have non exhaustively tried to review research work concerned with the investigation of EMI in ICs and prediction of this EMI using various modelling methodologies and measurement setups.
“…To reduce the area and have a symmetrical layout of the BJTs, we chose n equal to two and the collector currents I C1 and I C2 in the ratio of 2 : 3. The chosen BJT's ratio requires only two dummy BJTs connected in parallel to Q2 for the compensation of leakages as we used in [9]. Figure 5 shows the symmetrical layout of five BJTs in one row.…”
Section: Collector Leakage Current Compensationmentioning
confidence: 99%
“…We chose the compensation BJT Q3 (see Fig. 5) with a floating emitter [9] and a shorted base-emitter (BE) junction connected to emitter of Q2 [12] as two different versions for the leakage compensation. With the floating emitter, we expect mainly impact of the collector substrate junction leakage.…”
Section: Investigated Bandgap Coresmentioning
confidence: 99%
“…With the increasing advent of high-speed mixed-signal and radio frequency (RF) devices, the automotive industry also sets high requirements for very low electromagnetic emission (EME) and high immunity to electromagnetic interference (EMI). This aggressive EMI can easily couple from an application ambient to the IC via cable harness or printed circuit board (PCB) tracks [9].…”
This paper presents a comparative EMC susceptibility study of various integrated bandgap voltage reference cores. Conventional well-known bandgap references based on Kuijk, Brokaw and Tsividis concepts with reduced count of bipolar junction transistors in the core were analyzed. On top of the EMC susceptibility comparison, basic parameters like temperature drift, sensitivity to an operational amplifier input offset and line regulation are also discussed. The influence of a collector leakage current compensation at high temperatures is investigated as well.
“…To not introduce any error, these building blocks should be designed according to the existing design guidelines to avoid any EMI-induced offset at their outputs [37][38][39][40]. In this way, the proper input DC current I IN can be provided even if still affected by a superimposed EMI current i emi .…”
Section: A New Current Generator Robust To Emimentioning
The paper deals with the immunity to Electromagnetic Interference (EMI) of the current source for Ultra-Low-Voltage Integrated Circuits (ICs). Based on the properties of IC building blocks, such as the current-splitter and current correlator, a novel current generator is conceived. The proposed solution is suitable to provide currents to ICs operating in the sub-threshold region even in the presence of an electromagnetic polluted environment. The immunity to EMI of the proposed solution is compared with that of a conventional current mirror and evaluated by analytic means and with reference to the 180 nm CMOS technology process. The analysis highlights how the proposed solution generates currents down to nano-ampere intrinsically robust to the Radio Frequency (RF) interference affecting the input of the current generator, differently to what happens to the output current of a conventional mirror under the same conditions.
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