An approach of modifying poly(aryl ether ketone) to phenol-containing poly(aryl ether) and its application in preparing high-performance epoxy thermosets

Lin, Ching Hsuan; Wang, Yu Ru; Feng, Yu Ren; Wang, Meng Wei; Juang, Tzong Yuan

doi:10.1016/j.polymer.2013.01.034

Cited by 29 publications

(28 citation statements)

References 49 publications

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“…5) region of the spectrum of ESOP were replaced by multi peaks (peak 9 in Fig. 6) at ı = 7.3-8.0 ppm corresponding to protons on the phosphaphenanthrene groups, indicated that the epoxy groups of ESOP was reacted with DOPO (Lin et al, 2013;Chang et al, 2012). The 1 H NMR spectrum of PSOP (Fig.…”

Section: H Nmr Of So Sop Esop Psop and Psopementioning

confidence: 95%

Synthesis and application of phosphaphenanthrene groups-containing soybean-oil-based plasticizer

Jia

Feng

et al. 2015

Industrial Crops and Products

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Section: H Nmr Of So Sop Esop Psop and Psopementioning

confidence: 95%

Synthesis and application of phosphaphenanthrene groups-containing soybean-oil-based plasticizer

Jia

Feng

et al. 2015

Industrial Crops and Products

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“…The heat flow measured in DSC is proportional to both the overall heat release and the curing rate, as shown by Equation (1) [16]: (1) where dQ/dt is the heat flow, Q thr is the total heat released when an uncured material is brought to complete cure, da/dt is the curing rate, a is the extent of reaction, k(T) is the rate constant, T is the temperature, and f(a) is the reaction model. For epoxy curing, f(a) is usually taken in the form of (1 -a) n (n th -order reaction) or of a m (1 -a) n (autocatalytic reaction).…”

Section: Theoretical Calculationsmentioning

confidence: 99%

“…For example, epoxy resins possess excellent thermal stability, moisture resistance, chemical stability, superior electrical and mechanical properties and good adhesion to many substrates [1][2][3]. As well as known properties, such as, the superior mechanical and chemical properties of epoxy polymers are profited from the complicated curing processes, in which a low molecular weight oligomer is transformed into an infinite molecular weight polymer forming a three-dimensional network structure.…”

Section: Introductionmentioning

confidence: 99%

Curing kinetics, mechanism and chemorheological behavior of methanol etherified amino/novolac epoxy systems

Zhao¹,

Zhang²,

Sun³

et al. 2014

Express Polym. Lett.

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Abstract. The curing kinetics and mechanism of epoxy novolac resin (DEN) and modified epoxy novolac resin (MDEN) with methanol etherified amino resin were studied by means of differential scanning calorimetry (DSC), Fourier transforminfrared (FT-IR) spectroscopy and chemorheological analysis. Their kinetics parameters and models of the curing were examined utilizing isoconversional methods, Flynn-Wall-Ozawa and Friedman methods. For the DEN mixture, its average activation energy (E a ) was 71.05 kJ/mol and the autocatalytic model was established to describe the curing reaction. The MDEN mixture exhibited three dominant curing processes, termed as reaction 1, reaction 2 and reaction 3; and their E a were 70.05, 106.55 and 101.91 kJ/mol, respectively. Besides, E a of reaction 1 was similar to that of DEN mixture, while E a of reactions 2 and 3 corresponded to that of the etherification reaction between hydroxyl and epoxide group. Moreover, these three dominant reactions were n th order in nature. Furthermore, their curing mechanisms were proposed from the results of DSC and FTIR. The chemorheological behavior was also investigated to obtain better plastics products via optimizing the processing schedules.

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“…Epoxy resins have been widely applied in many areas, such as aerospace and electronics industries in the form of surface coating, structural adhesives, advanced composites, and packaging materials due to their well‐balanced properties. For example, epoxy resins have excellent thermal stability, moisture resistance, chemical stability, superior electrical, and mechanical properties and good adhesion to many substrates . However, when epoxy resins were used as packaging materials in integrated circuit, many problems have been appeared especially after the soldering reflow process, such as packaging cracking, delamination and poor performance in humidity testing.…”

Section: Introductionmentioning

confidence: 99%

Multifunctionalization of novolac epoxy resin and its influence on dielectric, thermal properties, viscoelastic, and aging behavior

Zhao

Zhang

Sun

et al. 2013

J of Applied Polymer Sci

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In this article, novolac epoxy was functionalized using p-hydroxybenzoic acid as pendent groups, which offered weak acidic environment and were cured with methyl etherified amino resin (HMMM). Its chemical structure was characterized by Fourier transform infrared (FT-IR), 1 H nuclear magnetic resonance ( 1 H NMR) and differential scanning calorimeter (DSC). To comprehensively investigate its performance, HMMM was used as a curing agent. The modified epoxy exhibited higher storage modulus, lower thermal expansion coefficient, better moisture resistance, better resistance to degradation and lower dielectric constant. Furthermore, the aging behavior was investigated using dynamic mechanical analysis and scanning electron microscopy, which showed that the activation energy of glass transition increased after aging and cured MDEN was more difficult to age. Moreover, the relation between storage modulus and curing rate was established; the low curing rate of MDEN decreased the growth rate of storage modulus and reduced the internal stress, which was beneficial for processing.

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An approach of modifying poly(aryl ether ketone) to phenol-containing poly(aryl ether) and its application in preparing high-performance epoxy thermosets

Cited by 29 publications

References 49 publications

Synthesis and application of phosphaphenanthrene groups-containing soybean-oil-based plasticizer

Synthesis and application of phosphaphenanthrene groups-containing soybean-oil-based plasticizer

Curing kinetics, mechanism and chemorheological behavior of methanol etherified amino/novolac epoxy systems

Multifunctionalization of novolac epoxy resin and its influence on dielectric, thermal properties, viscoelastic, and aging behavior

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