Abstract:Backside illuminated (BSI) technologies have been commonly used in CMOS image sensors and are finding a renewed interest for images and detectors for LiDAR application that has been driven by the automotive industry. As the integration of signal processing into microelectronic detectors progresses, active area and fill factor become issues for monolithic solutions. Processing the detector and readout circuitry (ROIC) on different wafers allows for the separate optimization of cost and performance. As a result,… Show more
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