An accurate assessment of interconnect fatigue life through power cycling

Ahmed, Izhar Z.; Park, S.B.

doi:10.1109/itherm.2004.1318310

Cited by 8 publications

(4 citation statements)

References 6 publications

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“…Then, power cycling simulation is conducted in CFD to correlate the thermal simulation with the thermo-mechanical simulation. The convection heat transfer coefficient obtained from the power cycling simulation is used as the boundary condition in the thermo-mechanical analysis [5]. In the thermo-mechanical analysis, three parameters are investigated: 1) underfill Young's modulus; 2) underfill CTE; and 3) underfill Tg.…”

Section: Introductionmentioning

confidence: 99%

Optimization of underfill material for better reliability and thermal behavior of 3D packages with TSVs

Kim

Park

2013

2013 IEEE 63rd Electronic Components and Technology Conference

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The demands for a high-density, high-speed, and smaller integrated circuit have resulted in 3D stacked packages with through-silicon via (TSV) technology. Due to their sophisticated structure and complex manufacturing process, however, many issues related to the reliability and thermal management of these 3D packages are still under investigation. Failure at the solder joints between the chip and substrate is inevitable when the 3D package is exposed to thermal loading. The discrepancy in the coefficients of thermal expansion (CTE) between the chip and substrate subjects the solder joints to significant stress and strain. To reduce these thermally induced stresses and strains, an underfill has been used. The optimization of this underfill material is thus one of the most critical issues in improving the reliability and thermal performance of 3D packages. This paper describes a parametric study based on computational fluid dynamics (CFD) analysis to address the junction temperature of the package. The impact on the package temperature of various factors such as the thermal conductivity of underfill, mold compound, substrate, and copper bump ratio was investigated. In addition, the transient heat transfer coefficients from CFD analysis were extracted and used as a thermal boundary condition in thermal and structural finite element analysis (FEA). In thermal and structural simulation, the strain energy at the solder joint was compared by changing the material properties of the underfill. The modulus, CTE, and glass transition temperature (T g ) of the underfill were examined. The most effective material properties were adopted to minimize modeling complexity and reduce computing time. The results of this work should help to design more reliable 3D packages. IntroductionThe microelectronics industry is focusing on achieving a high-speed, high-function, and reduced power-consumption integrated circuit in a smaller package. As a result, 3D packaging is gaining popularity. However, the advantages of multi-chip stacking cannot be fully used by wire-bonding technology since the number of I/O pads on the chip has increased significantly. Thus, TSV technology has become an attractive option to achieve 3D packaging. 3D packages with TSV technology have not yet matured and, many challenges related to manufacturing processes, reliability, and thermal management still must be addressed. In particular, due to the vertically stacked structure of 3D packages, thermal management is the most critical concern. The heat flux generation by multi-stacked chips in one small package is

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Section: Introductionmentioning

confidence: 99%

Optimization of underfill material for better reliability and thermal behavior of 3D packages with TSVs

Kim

Park

2013

2013 IEEE 63rd Electronic Components and Technology Conference

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“…However, in the present study, maximum accumulated plastic work per cycle was used in place of volume averaged plastic work per cycle. This approach was used to achieve more realistic crack initiation across the solder interconnects since averaging of plastic work had a tendency to over predict the life of solder interconnects [1,11]. Mesh sensitivity issues can be avoided by using the same mesh size for all the analyses.…”

Section: Component Reliability Predictionmentioning

confidence: 99%

“…However, in case of organic packages depending upon chip, substrate, PCB dimensions and coefficients of thermal expansion, PC could be more severe condition than ATC and the assembly, which passed ATC, may not be safe in the field within its service life [1]. In this regard, detailed analysis of power cycling is required to project field life of organic packages.…”

Section: Introductionmentioning

confidence: 99%

“…The present study uses flow-thermo-mechanical analysis for power cycling simulation wherein integration of the interrelated quantities such as transient heat transfer coefficients, temperature, and deformation in and around the assembly in a convective environment are required [1]. The analysis incorporates maximum accumulated plastic work per cycle, local transient heat transfer coefficients, timeindependent plastic strain and three-dimensional FEA.…”

Section: Introductionmentioning

confidence: 99%

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Thermomechanical behavior of organic and ceramic flip chip BGA packages under power cycling

Park

Joshi

Sammakia

Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.

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Numerical and experimental techniques were employed to assess the thermomechanical behavior of ceramic and organic flip chip packages under power and accelerated thermal cycling (ATC).In power cycling (PC), the non-uniform temperature distribution and different coefficient of thermal expansion (CTE) of each component make the package deform differently than in the case of ATC. Conventionally, reliability assessment is conducted by ATC that assumes uniform temperature throughout the assembly. This is because, ATC is believed to be a worse case condition compared to PC, which is similar to the actual field condition.In this work, for ceramic and organic flip chip ball grid array (FC-BGA) package, numerical simulations of ATC and PC were performed by combination of computational fluid dynamics (CFD) and finite element analyses (FEA). For PC, CFD analysis was used to extract transient heat transfer coefficients while subsequent thermal and structural FEA was performed with heat generation and heat transfer coefficient from CFD as thermal boundary condition. The numerical simulations were compared with in-situ, real-time moiré interferometry experiment. It was found that for certain organic packages, power cycling was more severe condition that causes solder interconnects to fail earlier than ATC while ceramic packages fail earlier in ATC than PC. Accordingly, qualification based on ATC testing may overestimate the life of the package.

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Microstructural analysis of lead-free solder joint under thermo-mechanical loading

Hung

2012

2012 14th International Conference on Electronic Materials and Packaging (EMAP)

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An accurate assessment of interconnect fatigue life through power cycling

Cited by 8 publications

References 6 publications

Optimization of underfill material for better reliability and thermal behavior of 3D packages with TSVs

Optimization of underfill material for better reliability and thermal behavior of 3D packages with TSVs

Thermomechanical behavior of organic and ceramic flip chip BGA packages under power cycling

Microstructural analysis of lead-free solder joint under thermo-mechanical loading

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