The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (IEEE Cat. No.04CH37543)
DOI: 10.1109/itherm.2004.1318310
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An accurate assessment of interconnect fatigue life through power cycling

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Cited by 8 publications
(4 citation statements)
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“…Then, power cycling simulation is conducted in CFD to correlate the thermal simulation with the thermo-mechanical simulation. The convection heat transfer coefficient obtained from the power cycling simulation is used as the boundary condition in the thermo-mechanical analysis [5]. In the thermo-mechanical analysis, three parameters are investigated: 1) underfill Young's modulus; 2) underfill CTE; and 3) underfill Tg.…”
Section: Introductionmentioning
confidence: 99%
“…Then, power cycling simulation is conducted in CFD to correlate the thermal simulation with the thermo-mechanical simulation. The convection heat transfer coefficient obtained from the power cycling simulation is used as the boundary condition in the thermo-mechanical analysis [5]. In the thermo-mechanical analysis, three parameters are investigated: 1) underfill Young's modulus; 2) underfill CTE; and 3) underfill Tg.…”
Section: Introductionmentioning
confidence: 99%
“…However, in the present study, maximum accumulated plastic work per cycle was used in place of volume averaged plastic work per cycle. This approach was used to achieve more realistic crack initiation across the solder interconnects since averaging of plastic work had a tendency to over predict the life of solder interconnects [1,11]. Mesh sensitivity issues can be avoided by using the same mesh size for all the analyses.…”
Section: Component Reliability Predictionmentioning
confidence: 99%
“…However, in case of organic packages depending upon chip, substrate, PCB dimensions and coefficients of thermal expansion, PC could be more severe condition than ATC and the assembly, which passed ATC, may not be safe in the field within its service life [1]. In this regard, detailed analysis of power cycling is required to project field life of organic packages.…”
Section: Introductionmentioning
confidence: 99%
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