2014
DOI: 10.3390/s140407374
|View full text |Cite
|
Sign up to set email alerts
|

An Accurate and Computationally Efficient Model for Membrane-Type Circular-Symmetric Micro-Hotplates

Abstract: Ideally, the design of high-performance micro-hotplates would require a large number of simulations because of the existence of many important design parameters as well as the possibly crucial effects of both spread and drift. However, the computational cost of FEM simulations, which are the only available tool for accurately predicting the temperature in micro-hotplates, is very high. As a result, micro-hotplate designers generally have no effective simulation-tools for the optimization. In order to circumven… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2016
2016
2022
2022

Publication Types

Select...
3
2

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(2 citation statements)
references
References 34 publications
(70 reference statements)
0
2
0
Order By: Relevance
“…Khan and co-workers presented an effective model for circular symmetric microhotplates to calculate the temperature profile of the heated area (Khan and Falconi 2014). Based on similar thermal management strategy and FEM assisted design procedure, a 75 lm radius circular shaped microfilament was optimised with improved temperature uniformity by Ali et al (2009).…”
Section: Introductionmentioning
confidence: 99%
“…Khan and co-workers presented an effective model for circular symmetric microhotplates to calculate the temperature profile of the heated area (Khan and Falconi 2014). Based on similar thermal management strategy and FEM assisted design procedure, a 75 lm radius circular shaped microfilament was optimised with improved temperature uniformity by Ali et al (2009).…”
Section: Introductionmentioning
confidence: 99%
“…The models are based on a multiphysics approach involving electrical, thermal and fluidics aspects. The multiphysics approach has become the leading method to deal with high complex systems that cannot be uniformed on a single physics, and this is particularly evident for MEMS [ 16 , 17 , 18 ], where electrical, thermal and, sometimes, mechanical behaviors are responsible, at the same time, of the good functionality of the device The geometries, materials and physics are derived from the actual devices to obtain the best possible accuracy. In particular the Pt characteristics were investigated to obtain the experimental Temperature Coefficient of Resistance (TCR) to be included as an input in the models.…”
Section: Introductionmentioning
confidence: 99%