An 8-bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C airborne early warning aircraft radar

Thompson, R.L.; Degerstrom, Michael J.; Walters, W.L.; Vickberg, M.; Riemer, P.J.; Amundsen, L.H.; Gilbert, Barry K.

doi:10.1109/tcpmb.1998.730431

Cited by 10 publications

(3 citation statements)

References 7 publications

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“…33 An all-digital upgrade to the US navy's E2-C Hawkeye airborne early warning receiver, built around an 8-bit monolithic Multichip Module (MCM) ADC integrated circuit, was developed at a sample rate of 2.5 GHz. The module was tested using 800 mV peak-to-peak sinusoids with a frequency of 400 MHz.…”

Section: Receiver Architectures Comparisonmentioning

confidence: 99%

Feasibility of a multipurpose transceiver module for phased array radar and EW applications using RFIC technology

Al-Sarawi

Hansen

Zhu

2007

Microelectronics: Design, Technology, and Packaging III

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Phased array antennas have a large number of civilian and military applications. In this paper we briefly review common approaches to an integrated implementation of radar and electronic warfare digital phase array module and highlight features that are common to both of these applications. Then we discuss how the promising features of the radio frequency integrated circuit (RFIC)-based technology can be utilized in building a transceiver module that meets the requirements of both radar and electronic warfare applications with minimum number of external components. This is achieved by researching the pros and cons of the different receiver architectures and their performance from the targeted applications point of view. Then, we survey current RFIC technologies and highlight the pros and cons of these technologies and how they impact the performance of the discussed receiver architectures.

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Section: Receiver Architectures Comparisonmentioning

confidence: 99%

Feasibility of a multipurpose transceiver module for phased array radar and EW applications using RFIC technology

Al-Sarawi

Hansen

Zhu

2007

Microelectronics: Design, Technology, and Packaging III

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“…In such radars, several techniques such as digital filtering, electronic beam-steering, adaptive beamforming, and other digital processing techniques can be used to extract target information [7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Miniaturised stretch processed radar transceiver

Taghadosi

Albasha

Mir

2018

IET Microwaves, Antennas & Propagation

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A miniaturisation of an architecture novel for an S‐band radar testbed is reported. The fabricated radar is a low‐cost, high‐performance and printed circuit board (PCB)‐based system. The system and its individual sub‐stages along with the miniaturised radar prototype have been simulated using advanced design system and applied wave research. Printed filters replacing bulky microwave components and impedance matching techniques to minimise power losses in the amplifiers are reported. The measured results are compared with electromagnetic simulations. The reduction in the overall system package size is significant, without degrading performance. The insertion loss and signal reflections through different stages are reduced, which contributed significantly to the enhancement of the measurement. The implemented radar PCB prototype used stretch processing technique to achieve high dynamic range of 75 dB, experimentally measured over a wide signal bandwidth of 600 MHz. This achieves a range resolution of 0.25 m. The overall dynamic range of the new single‐type‐substrate system has been improved by 15 dB, while miniaturising the overall size to enable light weight portable packaging. The achieved performance is, to the best of the authors’ knowledge, the highest reported in literature for similar type of radar testbeds that can be used for advanced industrial and military applications.

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“…Nevertheless, the quality of MCM-L integrated passives are relatively poor and limited to low frequencies [18] and may waste a large connection area because of wide line and separation width [19]. Although hybrid technology is also a candidate [20], [21], they occupy large areas and special consideration may be required for connections and arrangement of parts to prevent degradation of its characteristics [22], [23].…”

Section: Introductionmentioning

confidence: 99%

Wafer-Level Integration Technique of Surface Mount Devices on a Si-Wafer With Vibration Energy and Gravity Force

Sudou

Takao²,

Sawada³

et al. 2007

IEEE Trans. Comp. Packag. Technol.

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This paper reports about a novel wafer-level integration technique of discrete surface mount devices (SMDs). It enables wafer-level mounting of plural kinds of SMDs on a silicon (Si)-wafer using vibration and gravity force. Deep holes with 400-m depth are formed on the surface of a Si-wafer by deep reactive ion etching process after general integrated circuit process for positioning of SMDs. A non-conductive adhesive (CYTOP) are coated on the deep holes and it is used to fix the aligned SMDs. SMDs are distributed on a Si-wafer mounted on vibration generator, and then a vibration is applied. The SMDs migrate due to the reduced friction between the wafer surface, and they drop into the holes on the silicon wafer. The size of the holes has an appropriate clearance to the size of SMD. In order to align two or more kinds of SMDs, sizes of the deep holes on a Si-wafer are adjusted to the size of each SMD. SMDs with the largest size are dropped into the holes first, and then the secondary large SMDs are dropped into the holes with the corresponding size. SMDs are finally connected electrically by wire bonding at the final step. In the experiment, two different sizes of SMD were successfully mounted into all the holes on a Si-wafer automatically. This technology will be a wafer-level process technology which is very promising to integrate two or more kinds of discrete elements.Index Terms-Embedded passive integrated circuits (emPIC), passive integration, silicon integrated circuit (IC) technology.

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An 8-bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C airborne early warning aircraft radar

Cited by 10 publications

References 7 publications

Feasibility of a multipurpose transceiver module for phased array radar and EW applications using RFIC technology

Feasibility of a multipurpose transceiver module for phased array radar and EW applications using RFIC technology

Miniaturised stretch processed radar transceiver

Wafer-Level Integration Technique of Surface Mount Devices on a Si-Wafer With Vibration Energy and Gravity Force

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