1998
DOI: 10.1016/s0304-3991(97)00120-4
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Amorphisation and surface morphology development at low-energy ion milling

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1998
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Cited by 115 publications
(58 citation statements)
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“…A recently developed trial and error method was used to calculate the original concentration distribution from the measured depth profile. 16,17 This method supposes that the majority of the ion induced alteration is due to ballistic mixing ͑which assumption is satisfied for this case, since the other important distorting process the surface roughening results in less than 1 nm rms roughness using the earlier sputtering parameters͒, 18 which is properly described by TRIM simulation. 17,19 The method also considers the intrinsic interface roughness or waviness by a Gaussian broadening.…”
mentioning
confidence: 99%
“…A recently developed trial and error method was used to calculate the original concentration distribution from the measured depth profile. 16,17 This method supposes that the majority of the ion induced alteration is due to ballistic mixing ͑which assumption is satisfied for this case, since the other important distorting process the surface roughening results in less than 1 nm rms roughness using the earlier sputtering parameters͒, 18 which is properly described by TRIM simulation. 17,19 The method also considers the intrinsic interface roughness or waviness by a Gaussian broadening.…”
mentioning
confidence: 99%
“…3(a), area (1)) with epitaxial relations: hR6-CaSi2[100]||Si [1][2][3][4][5][6][7][8][9][10] and hR6-CaSi2(001)||Si(111). The identification of the SA FFT pattern for area (1) results in the un-defective CaSi2 layer growth on Si(111)7x7 surface without stacking faults in 3-4 unit cell thickness.…”
Section: Resultsmentioning
confidence: 99%
“…For the TEM study, the specimens were thinned by special procedure, which was explained in previous article [8], involving cutting with a diamond saw, embedding the pieces into a special titanium disk, mechanical grinding and polishing, and finally ion beam milling. Ar + ions of 10 keV energy were used until perforation, followed by low-energy (3 keV) milling to minimize surface damage.…”
Section: Methodsmentioning
confidence: 99%
“…Formation of amorphous layer is materials-dependent; semiconductor and ceramic materials easily amorphize when compared with metals (Huh et al, 2013). Decreasing the energy and the incident angle of the incoming ions can reduce the effect (Barna et al, 1998).…”
Section: Introductionmentioning
confidence: 99%