carrier mobility of the semiconductor channel drop sharply, the electrostatic gate control ability weak and the short channel effect prominent. [4][5][6] In such a case, the subthreshold slope (SS) of the devices will increase and the leakage current will become impressive, leading to non-negligible static power consumption. Therefore, it is very necessary to exploit new device structures and channel materials to effectively lower the SS and enhance the gate control ability to meet the needs of the low power consumption.As one of the emerging device structures, negative capacitance field-effect transistor (NC-FET) has attracted much attention. [7][8][9] It is achieved with a ferroelectric field-effect transistor (FeFET) device configuration, in which the dielectric is replaced by ferroelectric materials. The negative capacitance is realized by the polarization switch of the ferroelectric dielectric, which gives a chance to get steep SS to overcome the limit of 60 mV dec â1 (at room temperature) dominated by the Boltzmann distribution. [10][11][12] Up to now, many ferroelectric materials like organic poly(vinylidene difluoride-trifluoroethylene) [P(VDF-TrFE)] [13,14] and inorganic perovskite lead zirconate titanate (PZT) [15,16] have been successfully applied to NC-FETs. Recently, the discovery of ferroelectricity in Hf x Zr 1âx O 2 (HZO) further promotes the development in this field for its scalable thickness and compatibility with commercial semiconductor technology. [17][18][19] HZO has been currently applied to NC-FETs and shows the possibility to lower the SS far less than 60 mV dec â1 , indicating great potential for low-power integrated electronics. [18] To continue the effective electrostatic control in field-effect transistors (FETs), the channel semiconductor thickness should be less than the electrostatic screening length and one-third of the gate length. [20,21] On this point, 2D layered semiconductors are of obvious advantages, [22][23][24][25][26] which are the thinnest crystals (typically less than 1 nm) with excellent electronic properties, providing a possibility to push down the device feature size to even less than 3 nm without the loss of electrostatic control ability. [27,28] Among various 2D layered materials, ambipolar 2D semiconductors, like WSe 2 , are promising for electronic circuit design because of that both P-type and N-type transistors can be achieved in the same layer and easily homogeneously integrated for complementary metal oxide semiconductor (CMOS)