2002
DOI: 10.1016/s0022-0248(02)00917-x
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Aluminum p-type doping of silicon carbide crystals using a modified physical vapor transport growth method

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Cited by 56 publications
(40 citation statements)
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“…These were compared to experiments for validation of the calculated data. [7,8] The results of these calculations are summarized in Figure 2. At a high internal gas flux, the concentration of the SiC gas species in front of the phase boundary is significantly reduced, especially at the center of the growth chamber.…”
Section: Influence Of the Internal Gas Flowmentioning
confidence: 99%
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“…These were compared to experiments for validation of the calculated data. [7,8] The results of these calculations are summarized in Figure 2. At a high internal gas flux, the concentration of the SiC gas species in front of the phase boundary is significantly reduced, especially at the center of the growth chamber.…”
Section: Influence Of the Internal Gas Flowmentioning
confidence: 99%
“…A crystal grown in such a way consists of a very highly doped zone near the seed while the aluminum incorporation decreases exponentially. [7] Hence, the yield of wafers with a desired aluminum concentration is very low. To achieve high aluminum concentrations for low specific resistivity, the extremely high dopant concentration in the system leads to such a high aluminum flux in the first growth stages that the crystal quality is severely affected.…”
Section: Aluminummentioning
confidence: 99%
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“…Apart from these well-established techniques, emerging processes should be considered in the near future. One could cite, for example, the halide CVD alternative technique [7] or the modified PVT [8] process for doping control during growth. Along this line, the continuous feed (CF) PVT method was recently proposed as a new process concept to grow large boules of high-purity material.…”
Section: Introductionmentioning
confidence: 99%