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2021
DOI: 10.1007/s42114-021-00265-6
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Aluminum dihydric tripolyphosphate/polypyrrole-functionalized graphene oxide waterborne epoxy composite coatings for impermeability and corrosion protection performance of metals

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Cited by 104 publications
(27 citation statements)
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“…Epoxy resins are widely used in many areas of coatings, , sealants, adhesives and so on due to the high chemical stability, strong adhesion to metal surfaces, low shrinkage, and superior mechanical property. , Conventional epoxy anticorrosive coatings are typical solvent-borne and contain high levels of volatile organic compounds (VOCs), which cause serious environmental pollution and endanger human health. Nowadays, the waterborne epoxy (WEP) coating has attracted widespread attention due to the low levels of VOCs and environmental friendliness .…”
Section: Introductionmentioning
confidence: 99%
“…Epoxy resins are widely used in many areas of coatings, , sealants, adhesives and so on due to the high chemical stability, strong adhesion to metal surfaces, low shrinkage, and superior mechanical property. , Conventional epoxy anticorrosive coatings are typical solvent-borne and contain high levels of volatile organic compounds (VOCs), which cause serious environmental pollution and endanger human health. Nowadays, the waterborne epoxy (WEP) coating has attracted widespread attention due to the low levels of VOCs and environmental friendliness .…”
Section: Introductionmentioning
confidence: 99%
“…CPCs can be fabricated using a range of methods such as dispersing conductive fillers into flexible polymer matrices [ 16 ], depositing [ 17 ], transferring [ 18 ], or printing a conductive layer on prefabricated flexible polymer substrates [ 2 ]. However, the CPCs-based strain sensors are subject to low sensitivity and narrow working ranges because their conductive paths are often fragile and thus likely to be broken during stretching [ 19 , 20 , 21 ].…”
Section: Introductionmentioning
confidence: 99%
“…Epoxy composites have been widely used in microelectronic and optoelectronic devices as a substrate for printed circuit boards, packaging materials, and specific adhesives. [1][2][3] To satisfy the increasing demand of electronic components for dissipating the heat created during working, mesogenic groups were introduced to epoxy yielding liquid crystalline epoxy (LCE), [4][5][6][7][8][9] which is a common method for producing intrinsically thermally conductive polymers including liquid crystalline polyimide. 10 When LCE is cured, the mesogen groups spontaneously aggregate and form microscopically ordered structures.…”
Section: Introductionmentioning
confidence: 99%