Aluminum Alloy Package for Microwave Amplifier

Iikawa, T.; Sakai, Taiji; Okamoto, Shin; Natori, Keiko; Nagai, Toshiyuki

doi:10.1109/tchmt.1986.1136670

Cited by 8 publications

(2 citation statements)

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“…Recently, the thermal conductivity reduction of Ni plating on Cu and Al alloy packages in laser welding process has been reported [15]- [17]. With the formation of Ni/Cu or Ni/Al solid solution in the welded section, the thermal conductivity of Ni/Cu or Ni/Au is lower than that of pure Cu or Al.…”

Section: Discussionmentioning

confidence: 99%

Effect of Au thickness on laser beam penetration in semiconductor laser packages

Cheng

Wang²,

Yang³

et al. 1997

IEEE Trans. Comp., Packag., Manufact. Technol. B

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Comprehensive measurements of the dependence of the weld width, penetration depth, and joint strength on the Au coating thickness in laser welding techniques for semiconductor laser packages are presented. The results obtained from the Invar-Invar joints show that the welded joints with thick Au coating exhibit narrower weld width, shallower penetration, and hence less joint strength than those the package joints with thin Au coating. A finite-element method (FEM) has been carried out on the effect of Au thickness on laser beam penetration in Invar-Invar joints. This method has been employed successfully to predict the laser beam penetration in laser welded Au-coated materials that the weld width and the penetration depth are reduced as the Au coating thickness increases. The likely cause for the reduction is the increased thermal conduction of thicker Au in the welded region. In addition to Au coating, the effect of Ni coating on laser beam penetration is also presented. Detailed knowledge of the effect of Au coating thickness on laser beam penetration is important for the practical design and fabrication of reliable optoelectronic packaging having laser welded Aucoated materials.

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Section: Discussionmentioning

confidence: 99%

Effect of Au thickness on laser beam penetration in semiconductor laser packages

Cheng

Wang²,

Yang³

et al. 1997

IEEE Trans. Comp., Packag., Manufact. Technol. B

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show abstract

“…Metals with high κ have been widely used as heat dissipation materials in a variety of electronics applications, such as high-frequency packages that are used in data communications and microwave applications. [44][45][46] In spite of excellent heat dissipation performance, however, the use of the bulk metals is often discouraged because of their high densities while intrinsically high κ. 47 Recently, nanostructured metals -mostly nanowires (NWs) -are of much interest due to their unique optical, electrical, and thermal properties for various optoelectronics and energy applications.…”

Section: Electrically Conductive Fillersmentioning

confidence: 99%