“…The bow can cause GaN wafer cracking and peeling-off during the GaN lm growth through MOCVD and a misalignment of the LED patterns through lithography. 20 Thus, many studies on suppressing the bow in the growth process of an epitaxial GaN layer have been conducted using various technologies, such as the change in the III-V gas ratio for a stress-relaxed GaN layer, 21 self-separating GaN from the substrate, 22 simultaneous double-side growth of a GaN layer on a sapphire substrate, 23 and hydrogen-ion implantation for stress relaxation. 24 Even though the GaN wafer bow can be suppressed by the growth techniques, it uctuates during the wafering process, which makes a prediction of a nal GaN wafer bow very difficult.…”