Group IV semiconductor‐based alloy Ge1−xSnx can be grown on Si platform and a crossover from indirect (L valleys) to direct gap (Γ valley) occurs for x > 0.08. The direct gap alloy shows promise for use in high‐speed electronic and photonic devices. An earlier study predicted that the electron mobility in the alloy would increase by a few orders of magnitude above the value for pure Ge. In that work, however, electrons were assumed to occupy only the low effective mass Γ valley and only the deformation potential acoustic phonon and alloy scatterings were considered. In the present work, we give a more realistic estimate of the values of electron mobility in direct gap GeSn alloy, considering the Γ and L valleys and the phonon (deformation potential acoustic, optical and intervalley), alloy, and impurity scatterings. The effect of strain, both tensile and compressive, on the mobility is also studied. It is found that for higher alloy composition and suitable strain, mobility values ∼2 × 105 cm−2/V · s, more than 50 times higher than the value in pure Ge (3900 cm2/V · s) may be achieved. This is attributed to increased separation between Γ and L valleys and consequent reduction in intervalley scattering.