2015
DOI: 10.1002/adma.201503478
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All‐Printed, Foldable Organic Thin‐Film Transistors on Glassine Paper

Abstract: All-printed, foldable organic thin-film transistors are demonstrated on glassine paper with a combination of advanced materials and processing techniques. Glassine paper provides a suitable surface for high-performance printing methods, while graphene electrodes and an ion-gel gate dielectric enable robust stability over 100 folding cycles. Altogether, this study features a practical platform for low-cost, large-area, and foldable electronics.

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Cited by 182 publications
(208 citation statements)
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“…To increase the conductivity of final structures, post-processing methods, such as long-time thermal annealing [19,20,24] or compression rolling, [23,26] can be employed, thus, increasing the application potential of graphene-based printable conductors. In particular, thermal annealing is known to be a very efficient method to improve the conductivity of graphene, [19,20,24,27] as it results in desorption of the surface contaminants and degradation of binders and other ink components, e.g., rheology modifiers. However, the commonly used substrates, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and paper, do not tolerate long-time treatment at temperatures above 150 C, thus, preventing conventional thermal annealing approaches.…”
Section: Introductionmentioning
confidence: 99%
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“…To increase the conductivity of final structures, post-processing methods, such as long-time thermal annealing [19,20,24] or compression rolling, [23,26] can be employed, thus, increasing the application potential of graphene-based printable conductors. In particular, thermal annealing is known to be a very efficient method to improve the conductivity of graphene, [19,20,24,27] as it results in desorption of the surface contaminants and degradation of binders and other ink components, e.g., rheology modifiers. However, the commonly used substrates, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and paper, do not tolerate long-time treatment at temperatures above 150 C, thus, preventing conventional thermal annealing approaches.…”
Section: Introductionmentioning
confidence: 99%
“…[11][12][13] Even though the field of printable conductors is still mainly focused on metalbased (Ag, Cu, %50 mΩ & À1 at 25 mm thickness) [13,14] inks and PEDOT:PSS dispersions (%50 Ω & À1 ), [15] graphene-based conductive inks are gaining attention both from science [16][17][18][19][20][21][22][23][24] and technology. [25] Unfortunately, the conductive properties of graphene inks and printed structures thereof are still far from being a replacement for silver and copper inks.…”
Section: Introductionmentioning
confidence: 99%
“…
vital [ 25 ] as it facilitates thick layers (of up to 100 µm) in a single pass, however, at the expense of a lower printing defi nition.Following screen printing typically posttreatments such as drying, annealing, or top-coating are employed to maximize conductivities. The conditions of post-treatment defi ne the substrate that can be used for printing.
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mentioning
confidence: 99%
“…For example, ink annealing at 250 °C and higher for 30 min [ 18,24,25 ] signifi cantly limits the range of suitable substrates and fundamentally limits high speed R2R industrial realization. Thus, the design of graphene inks that meet the requirements of current R2R applications is still to be accomplished.There are several reports on the preparation of graphene-based inks comprising either graphene oxide (GO), [ 17,19,23,[27][28][29][30] or graphite exfoliated with [ 13,16,18,22,24,25 ] and without [ 20 ] surface active agents. The preparation of inks based on GO is relatively simple.…”
mentioning
confidence: 99%
“…Many research groups have fabricated conductive electrodes using different carbon-based fillers, such as carbon nanotubes (CNT) [9], graphene (G) [10] and graphene oxide (GO) [11]. Though all these materials offer excellent conductive properties, the raw materials are expensive and not easily modifiable in order to improve the conductive features of the final devices [12].…”
Section: Introductionmentioning
confidence: 99%