All-photonic drying and sintering process via flash white light combined with deep-UV and near-infrared irradiation for highly conductive copper nano-ink

Hwang, H. Y.; Oh, Kyunghwan; Kim, Kwang Ho

doi:10.1038/srep19696

Cited by 94 publications

(52 citation statements)

References 42 publications

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“…As shown in Supplementary Fig. S9 , the DSC curves of Sn and mixed Cu/Sn ink presented the endothermic peak around 230 °C while it did not exist in the Cu ink, which means that the Cu metal-mesh TCF has higher instantaneous temperature than Cu/Sn metal-mesh TCF under the same condition, causing unreleased massive stress 32 , 34 – 37 . On the other hand, the melting of Sn particles around Cu particles played the role of releasing part of stress caused by momentary temperature.…”

Section: Resultsmentioning

confidence: 97%

Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink

Chen

Shao

et al. 2017

Sci Rep

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With the help of photonic sintering using intensive pulse light (IPL), copper has started to replace silver as a printable conductive material for printing electrodes in electronic circuits. However, to sinter copper ink, high energy IPL has to be used, which often causes electrode destruction, due to unreleased stress concentration and massive heat generated. In this study, a Cu/Sn hybrid ink has been developed by mixing Cu and Sn particles. The hybrid ink requires lower sintering energy than normal copper ink and has been successfully employed in a hybrid printing process to make metal-mesh transparent conductive films (TCFs). The sintering energy of Cu/Sn hybrid films with the mass ratio of 2:1 and 1:1 (Cu:Sn) were decreased by 21% compared to sintering pure Cu film, which is attributed to the lower melting point of Sn for hybrid ink. Detailed study showed that the Sn particles were effectively fused among Cu particles and formed conducting path between them. The hybrid printed Cu/Sn metal-mesh TCF with line width of 3.5 μm, high transmittance of 84% and low sheet resistance of 14 Ω/□ have been achieved with less defects and better quality than printed pure copper metal-mesh TCFs.

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Section: Resultsmentioning

confidence: 97%

Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink

Chen

Shao

et al. 2017

Sci Rep

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“…33 Hwang et al reported that deep-UV sintering can result in dense packing of the printed nanoparticles. 34 When the same nanoparticle colloid was printed using Ar/H 2 plasma, it showed a significant rise in conductivity. Although the resistance is of the order of 140 Ω, the rise in conductivity is indicative of the fact that the in situ process can be used to create conductive patterns from rather insulating ink.…”

Section: Resultsmentioning

confidence: 99%

Plasma jet based in situ reduction of copper oxide in direct write printing

Dey

Lopez

Filipič

et al. 2019

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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Printing of nanostructured films with tailored oxidation state and electronic structure can have far reaching applications in several areas including printable electronics, optoelectronics, solar cells, catalytic conversion, and others. Widely used inkjet/aerosol/screen printing techniques require pre- and postprocessing for enhanced adhesion and tailoring of the chemical state of the thin film. Herein, we demonstrate atmospheric pressure plasma jet printing with unique capability to print and tune in situ the electronic properties and surface morphology of nanomaterials. Plasma printing of copper thin films with tailored oxidation state from an inexpensive copper oxide precursor is demonstrated and characterized using x-ray absorption spectroscopy, Raman spectroscopy, and electrical measurements.

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“…Testing or characterization validates the initial design. Adapted with permission from [9,[14][15][16][17][18][19][20]. 2 International Journal of Antennas and Propagation approaches.…”

Section: Challenges Aheadmentioning

confidence: 99%

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Rosker

Sandhu

Hester

et al. 2018

International Journal of Antennas and Propagation

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Printing methods such as additive manufacturing (AM) and direct writing (DW) for radio frequency (RF) components including antennas, filters, transmission lines, and interconnects have recently garnered much attention due to the ease of use, efficiency, and low-cost benefits of the AM/DW tools readily available. The quality and performance of these printed components often do not align with their simulated counterparts due to losses associated with the base materials, surface roughness, and print resolution. These drawbacks preclude the community from realizing printed low loss RF components comparable to those fabricated with traditional subtractive manufacturing techniques. This review discusses the challenges facing low loss RF components, which has mostly been material limited by the robustness of the metal and the availability of AM-compatible dielectrics. We summarize the effective printing methods, review ink formulation, and the postprint processing steps necessary for targeted RF properties. We then detail the structure-property relationships critical to obtaining enhanced conductivities necessary for printed RF passive components. Finally, we give examples of demonstrations for various types of printed RF components and provide an outlook on future areas of research that will require multidisciplinary teams from chemists to RF system designers to fully realize the potential for printed RF components.

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All-photonic drying and sintering process via flash white light combined with deep-UV and near-infrared irradiation for highly conductive copper nano-ink

Cited by 94 publications

References 42 publications

Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink

Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink

Plasma jet based in situ reduction of copper oxide in direct write printing

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

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