All-Inkjet-Printed Bottom-Gate Thin-Film Transistors Using UV Curable Dielectric for Well-Defined Source-Drain Electrodes

Castro, H.F.; Sowade, Enrico; Rocha, J. G.; Alpuim, P.; Lanceros‐Méndez, S.; Baumann, Reinhard R.

doi:10.1007/s11664-014-3143-0

Cited by 32 publications

(27 citation statements)

References 19 publications

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“…Inkjet printing is a well accepted deposition technology for functional materials in the area of printed electronics [1][2][3][4][5][6][7][8][9][10][11][12]. It allows the precise deposition of patterned functional layers on both rigid and flexible substrates.…”

Section: Introductionmentioning

confidence: 99%

Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application

Mitra¹,

Sternkiker²,

Martínez‐Domingo³

et al. 2017

Flex. Print. Electron.

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All inkjet printed rectifying diodes based on a metal-insulator-semiconductor (MIS) layer stack are presented. The rectifying properties were optimized by careful selection of the insulator interlayer thickness and the layout structure. The different diode architectures based on the following materials are investigated: (1) silver/poly (methylmethacrylate-methacrylic acid)/polytriarylamine/silver, (2) silver/polytriarylamine/poly (methylmethacrylate-methacrylic acid)/silver, and (3) silver/poly (methylmethacrylate-methacrylic acid)/poly-triarylamine/poly(3,4-ethylenedioxythiophene) poly (styrenesulfonate). The MIS diodes show an averaged rectification ratio of 200 and reasonable forward current density reaching 40 mA cm −2 . They are suitable for a number of applications in flexible printed organic electronics.

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Section: Introductionmentioning

confidence: 99%

Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application

Mitra¹,

Sternkiker²,

Martínez‐Domingo³

et al. 2017

Flex. Print. Electron.

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“…OFETs, which are a basic component of electronic circuits, are commonly produced via inkjet printing. Inkjet printing can fully realize inexpensive and flexible OFETs that employ a number of different functional organic materials (e.g., semiconducting materials and polymer dielectric/conducting materials) . The electronic elements of these OFETs are independently deposited to form layer‐to‐layer structures for specific device configurations.…”

Section: Heterogeneous Patterning Of Organic Materialsmentioning

confidence: 99%

“…This often leads to poor device performance, and low process‐to‐process and device‐to‐device reproducibility. The reported mobility values of all‐inkjet‐printed devices range from ≈10 −1 –10 −3 cm 2 V −1 s −1 , which is much lower than those of single‐crystal OFETs . Many efforts seeking to improve the morphology and crystallinity of inkjet‐printed semiconducting materials for high‐performance devices are currently in progress.…”

Section: Heterogeneous Patterning Of Organic Materialsmentioning

confidence: 99%

Heterogeneous Monolithic Integration of Single‐Crystal Organic Materials

et al. 2016

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Manufacturing high-performance organic electronic circuits requires the effective heterogeneous integration of different nanoscale organic materials with uniform morphology and high crystallinity in a desired arrangement. In particular, the development of high-performance organic electronic and optoelectronic devices relies on high-quality single crystals that show optimal intrinsic charge-transport properties and electrical performance. Moreover, the heterogeneous integration of organic materials on a single substrate in a monolithic way is highly demanded for the production of fundamental organic electronic components as well as complex integrated circuits. Many of the various methods that have been designed to pattern multiple heterogeneous organic materials on a substrate and the heterogeneous integration of organic single crystals with their crystal growth are described here. Critical issues that have been encountered in the development of high-performance organic integrated electronics are also addressed.

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“…또한 저렴 한 용액 공정, 대면적화 그리고 제작 공정이 간단하다는 장점을 가지고 있어 향후 다양한 유연 소자에 적용 가능한 기술로 주목 받고 있다 [1,2] . 이러한 유기반도체를 이용한 유연소자의 전극은 증착 (evaporation) [4,12] , 잉크젯 프린팅(inkjet printing) [7] 그리고 rollto-roll(R2R) [8] 과 같은 기술들을 사용해 오고 있다. 이 중 증착 기 [9] , 전극 배열 (array)을 형성하지 않고 하나의 트랜지스터를 만들어 특성을 측정 했다 [10] .…”

Section: 서 론 최근 유연소자 기술의 등장과 함께 기존의 반도체 산업에 주축인 실리콘 기반 제조기술의 단점을 보완하기unclassified

“…유연소자에 기반이 되는 유기 반도체 는 저온에서 다양한 유연 기판 위에 화학적 센서 [3,4] , 로직소자 . 이러한 유기반도체를 이용한 유연소자의 전극은 증착 (evaporation) [4,12] , 잉크젯 프린팅(inkjet printing) [7] 그리고 rollto-roll(R2R) …”

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Laser Sintering of Silver Nanoparticle for Flexible Electronics

Jia¹,

Park²,

Noh³

et al. 2015

Journal of The Korean Society of Manufacturing Technology Engin

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Article history:We present a fine patterning method of conductive lines on polyimide (PI) and glass substrates using silver (Ag) nanoparticles based on laser scanning. Controlled laser irradiation can realize selective sintering of conductive ink without damaging the substrate. Thus, this technique easily creates fine patterns on heat-sensitive substrates such as flexible plastics. The selective laser sintering of Ag nanoparticles was managed by optimizing the conditions for the laser scan velocity (1.0-20 mm/s) and power (10-150 mW) in order to achieve a small gap size, high electrical conductivity, and fine roughness. The fabricated electrodes had a minimum channel length of 5 µm and conductivity of 4.2 × 10 5 S/cm (bulk Ag has a conductivity of 6.3 × 10 5 S/cm) on the PI substrate. This method was used to successfully fabricate an organic field effect transistor with a poly(3-hexylthiophene) channel. . 유연소자에 기반이 되는 유기 반도체 는 저온에서 다양한 유연 기판 위에 화학적 센서 [3,4] , 로직소자 . 이러한 유기반도체를 이용한 유연소자의 전극은 증착 (evaporation) [4,12] , 잉크젯 프린팅(inkjet printing) [7] 그리고 rollto-roll(R2R)

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All-Inkjet-Printed Bottom-Gate Thin-Film Transistors Using UV Curable Dielectric for Well-Defined Source-Drain Electrodes

Cited by 32 publications

References 19 publications

Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application

Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application

Heterogeneous Monolithic Integration of Single‐Crystal Organic Materials

Laser Sintering of Silver Nanoparticle for Flexible Electronics

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