All-in-One Package Ultracompact Micropower Module Using Thin-Film Inductor

Sato, F.; Ono, Takayuki; Wako, N.; Arai, Soichi; Ichinose, Toshiaki; Oba, Yuto; Kanno, Shoichiro; Sugawara, E.; Yamaguchi, Masahiro; Matsuki, H.

doi:10.1109/tmag.2004.832176

Cited by 17 publications

(5 citation statements)

References 4 publications

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“…As the design was set at 25 µm, it resulted in a higher inductor resistance than that of the design, especially for the 16-turn inductor with the maximum resistance deviation. However, the inductor fabricated as a high aspect ratio structure had low DC resistance, as expected, and its resistance can be ranked in the low-resistance group compared to literature that lists resistance in a range of 9 mΩ-4.6 Ω [3], [5]- [7], [10], [11], [16]- [19]. High-frequency characterization was performed using a vector network analyzer Agilent 8650ES, and one port scattering (S 11 ) measurement was conducted in the frequency range of 30 kHz to 1 GHz while the parasitic capacitance of the DUT pad and connector were de-embedded using the admittance matrix method [15].…”

Section: Resultsmentioning

confidence: 59%

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Metal-Embedded SU-8 Slab Techniques for Low-Resistance Micromachined Inductors

Mapato

Klysuban²,

Kulworawanichpong

et al. 2018

IJRES

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This work presents new fabrication technique for micro power-inductors by using metal-embedded SU-8 slab techniques. This techniques used X-ray lithography to fabricate high aspect-ratio LIGA-like micro-structures in form of embedded structure in SU-8 slab and applied for inductor’s winding fabrication with aspect-ratio of 10. Thishigh-aspect ratiostructure can provide very low resistance winding but preserve small form factor and low profile. Inductors were designed as pot-core structures with8 μm-thick permalloy core and 250 μm-thick copper winding. 4-types of inductors were fabricated including 3, 5, 10 and 16 turns in the area of 1.8 mm2 to 9.5 mm2. All inductors have overall heights of 370 μm, measured inductance value in a range of 70 nH to 1.3 μH at 1 MHz and DC resistance value of 30 mΩ to 336 mΩ for 3 turns to 16 turns respectively. From this result, high aspect-ratio inductors show<span style="font-size: 10.0pt; font-family: 'Times New Roman','serif'; mso-fareast-font-family: Calibri; mso-bidi-font-family: 'Cordia New'; mso-bidi-theme-font: minor-bidi; mso-ansi-language: EN-US; mso-fareast-language: EN-US; mso-bidi-language: TH;"> good results including low-resistance, high inductance, and a small form factor as expected.

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Section: Resultsmentioning

confidence: 59%

“…. Inductance and resistance of fabricated inductors compared to literature values: [3], [5]- [7], [10], [11] and [16]- [19]: (a) inductance and resistance (b) inductance and conductivity per area…”

Section: Resultsmentioning

confidence: 99%

Metal-Embedded SU-8 Slab Techniques for Low-Resistance Micromachined Inductors

Mapato

Klysuban²,

Kulworawanichpong

et al. 2018

IJRES

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“…In an attempt to understand the trends in this rapidly evolving area, this paper presents an overview of the progress of the performance of the typical dc-dc converter platforms outlined above. The accompanying figures provide plots of data for a range of dc-dc converter platforms ranging from commercial power modules [7][8][9][10][11][12][13][14] and PwrSiP products [2][3][4][5][6] to PwrSiP and PwrSoC research demonstrators which have been reported in the recent literature [15][16][17][18][19][20][21][22][23][24][25][26][27][28][29][30][31]. Figure 3 compares the power densities of the different power converters including power modules, power supply in package (PwrSiP) and power supply on chip (PwrSoC).…”

Section: Roadmap For Dc-dc Power Convertersmentioning

confidence: 99%

PwrSoC (integration of micro-magnetic inductors/transformers with active semiconductors) for more than Moore technologies

Mathúna

Wang

Kulkarni

et al. 2013

Eur. Phys. J. Appl. Phys.

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“…Thin-film magnetic inductors are useful for integrated power delivery solutions for microprocessors and mobile devices [1] [2]. In recent years, with the rapid development of MEMS fabrication technology, specially the Quasi LIGA processing technology based on the 3D non-silicon materials becomes one of the most advanced technologies to study on micro-inductive device.…”

Section: Introductionmentioning

confidence: 99%

Characteristics of double planar thin film inductor with Ni-based magnetic film for DC/DC integration

Chen¹,

Ding²,

Zhao³

2016

Proceedings of the 2016 International Symposium on Advances in Electrical, Electronics and Computer Engineering

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Abstract.This paper mainly describes the design, fabrication and test of double planar thin film inductor. The thin film inductor has a sandwich structure, which consists of a double-square spiral planar Cu coil between top and bottom Ni magnetic thin films on a glass substrate; it is fabricated by dry and wet processes. The inductor is 2.7 x 1.9 mm 2 in area，which is suitable for a MHz switching DC -DC converter integration. The finally measurement shows that inductance of 0.71uH constant up to 1.5MHz, and a quality factor of 1.09 at 1.5 MHz.

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All-in-One Package Ultracompact Micropower Module Using Thin-Film Inductor

Cited by 17 publications

References 4 publications

Metal-Embedded SU-8 Slab Techniques for Low-Resistance Micromachined Inductors

Metal-Embedded SU-8 Slab Techniques for Low-Resistance Micromachined Inductors

PwrSoC (integration of micro-magnetic inductors/transformers with active semiconductors) for more than Moore technologies

Characteristics of double planar thin film inductor with Ni-based magnetic film for DC/DC integration

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