2018 IEEE International Electron Devices Meeting (IEDM) 2018
DOI: 10.1109/iedm.2018.8614668
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All CMOS Integrated 3D-Extended Metal Gate ISFETs for pH and Multi-Ion (Na+, K+, Ca2+) sensing

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Cited by 10 publications
(4 citation statements)
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“…Compared to the sensors based on surface plasmon resonance, quartz crystal microbalance, chemiluminescence, and chromatography, ISFETs are considered as the most promising sensors for building lab-on-a-chip platforms because of their compatibility with CMOS technology, which facilitates low cost through mass production while ensuring their portability and robustness . This allowed to develop a large-area ISFET-based biosensor array capable of detecting different biomaterials on the chip surface, which is suitable for the POC clinical diagnostics. …”
Section: Introductionmentioning
confidence: 99%
“…Compared to the sensors based on surface plasmon resonance, quartz crystal microbalance, chemiluminescence, and chromatography, ISFETs are considered as the most promising sensors for building lab-on-a-chip platforms because of their compatibility with CMOS technology, which facilitates low cost through mass production while ensuring their portability and robustness . This allowed to develop a large-area ISFET-based biosensor array capable of detecting different biomaterials on the chip surface, which is suitable for the POC clinical diagnostics. …”
Section: Introductionmentioning
confidence: 99%
“…where ∆φ S is the perturbation on the surface potential (see Fig. 2) and ζ 1 is a N ×N matrix containing the charge valence of ion species A 1 (in units of elementary charges) in the same cells where matrix A 1 has non-null elements 4 . Inserting Eq.…”
Section: A the Total Surface Admittancementioning
confidence: 99%
“…It is worth noting that the numerical implementation of the matrix Θ may lead to undetermined/infinite elements values 4 For example, for the generic reaction r ij shown in Eq. 9, these new matrices would be…”
Section: A the Total Surface Admittancementioning
confidence: 99%
“…A common approach for short design-to-product time is through packaging the sensors with the readout and control electronics in a printed circuit board (PCB) [2]. However, such systems are difficult to address the requirements of cost, form factor and power, though a certain flexibility can be achieved by assembling components on a flexible PCB [3,4].…”
Section: Introductionmentioning
confidence: 99%