Alkyl methyl silicone phase change materials for thermal interface applications

Phase change materials (PCMs) are an attractive alternative to thermal greasedpads. While their thermal conductivity is not as good as greases, they are more manufacturable. This paper reports on evaluation of PCMs for high power electronic applications. Conductivity measurements were carried out for several OEM PCMs. In addition experiments were carried out to determine process parameters (to attain target thermal impedance). A few candidates were then evaluated in a single chip module, under different environmental stresses and the results are presented here. The design concept was then extended to an MCM test vehicle and two candidate PCMs were evaluated. Differences in the reliability performance between SCM and MCM form factor are explained. 50-60 ParaffinWaX

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Shear Modulus Measurement for Thermal Interface Materials in Flip Chip Packages

Wang

2006

IEEE Trans. Comp. Packag. Technol.

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Alkyl methyl silicone phase change materials for thermal interface applications

Cited by 3 publications

References 3 publications

Combined effects of heat input and clamping pressure on the thermal performance of phase change thermal interface materials for electronics cooling applications

Combined effects of heat input and clamping pressure on the thermal performance of phase change thermal interface materials for electronics cooling applications

Phase change materials as a viable thermal interface material for high-power electronic applications

Shear Modulus Measurement for Thermal Interface Materials in Flip Chip Packages

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