Alkoxysilane Adhesion Promoter for Ag Nano-Ink

Hong, Jun Ui; Kumar, K. Dilip; Koo, Yang-Hyun; Kim, Hye Won; Park, Ji Hyun; Kang, Hyun Suk; Lee, Byung Cheol; Piao, Longhai; Kim, Sang-Ho

doi:10.5012/bkcs.2013.34.8.2539

Cited by 7 publications

(2 citation statements)

References 13 publications

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“…To address this issue, and to examine a more practical formulation for copper nitride ink, we investigated the use of a paste ink in which ethyl cellulose and poly(3-glycidoxypropyl)trimethoxysilane (PGPTMS) were used as a binder and adhesion reagent, respectively. It was previously reported that PGPTMS improves bonding strength between the particles in ink films and between the substrate and the film [ 28 , 29 ].…”

Section: Resultsmentioning

confidence: 99%

“…Poly(3-glycidoxypropyl)trimethoxysilane (PGPTMS) was synthesized in accordance with previous methods. [ 28 , 29 ] Briefly, GPTMS (24.8 g), distilled water (5.4 g), and aqueous hydrochloric acid (0.1 N, 5 mL) were mixed with tetrahydrofuran (200 mL) in a flask attached to a condenser. The solution was heated under reflux for 8 h, diluted with ethyl acetate (300 mL), and then washed with distilled water three times.…”

Section: Methodsmentioning

confidence: 99%

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Suitability of Copper Nitride as a Wiring Ink Sintered by Low-Energy Intense Pulsed Light Irradiation

Nakamura

Cheong

Takamura³

et al. 2018

Nanomaterials

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Copper nitride particles have a low decomposition temperature, they absorb light, and are oxidation-resistant, making them potentially useful for the development of novel wiring inks for printing circuit boards by means of intense pulsed light (IPL) sintering at low-energy. Here, we compared the thermal decomposition and light absorption of copper materials, including copper nitride (Cu3N), copper(I) oxide (Cu2O), or copper(II) oxide (CuO). Among the copper compounds examined, copper nitride had the second highest light absorbency and lowest decomposition temperature; therefore, we concluded that copper nitride was the most suitable material for producing a wiring ink that is sintered by means of IPL irradiation. Wiring inks containing copper nitride were compared with those of wiring inks containing copper nitride, copper(I) oxide, or copper(II) oxide, and copper conversion rate and sheet resistance were also determined. Under low-energy irradiation (8.3 J cm−2), copper nitride was converted to copper at the highest rate among the copper materials, and provided a sheet resistance of 0.506 Ω sq−1, indicating that copper nitride is indeed a candidate material for development as a wiring ink for low-energy intense pulsed light sintering-based printed circuit board production processes.

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Section: Resultsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%