Alkaline-developable Positive-type Photosensitive Polyimide based on Fluorinated Poly(amic acid) and Fluorinated Diazonaphthoquinone

Abstract

An alkaline-developable positive-type photosensitive polyimide (PSPI) based on fluorinated poly(amic acid) (FPAA) prepared from 4,4'-hexafluoroisopropyridenebis(phthalic anhydride) and 4,4'-oxydianiline, and fluorinated diazonaphthoquinone (FDNQ) as a dissolution inhibitor has been successfully developed. The solution of FPAA and FDNQ was spin-coated on a silicon wafer and prebaked, inducing a FDNQ rich surface which was supported by measurement of the contact angle of water on the films. The PSPI containing FPAA and FDNQ (25 wt% to FPAA) showed the high sensitivity of 45 mJ/cm 2 and excellent contrast (γ 0 ) of 10 when it was exposed to 365 nm wavelength light (i-line) and developed with a 2.38 wt% tetramethylammonium hydroxide aqueous solution at 25 o C. A clear positive pattern of a 6-µm line and space was obtained on a film when exposed to 120 mJ/cm 2 of i-line by a contact printing method.

Low‐temperature curable, alkaline‐developable, and negative‐type photosensitive polyimide with high resolution and mechanical properties based on chain extendable poly(amic acid) and photo‐base generator

“…PIs are conventionally patterned with an additional photoresist coated on the PI and lead to a sophisticated manufacturing procedure. In contrast, photosensitive PIs ( PSPIs ) streamline the manufacturing procedure through introducing photosensitivity into PIs or the precursor of PI, poly(amic acid ester) (PAE) and poly(amic acid) ( PAA ) 6‐10 …”

Alkaline‐developable positive‐type photosensitive polyimide with high mechanical strength and high resolution based on chain extendable poly(amic acid), thermally degradable cross‐linker and photoacid generator

“…On top of that, direct patterning of PSPIs and PSPBOs without the use of photoresist make the process simpler and thus lowering the manufacturing cost. Poly(amic acid) ( PAA ) derivatives are the most commercially available PSPI for microelectronic fabrication . TSPSPs should meet both of the following two requirements: precise photosensitive pattern formation properties and moderate mechanical endurances (i.e., tensile strength, Young's modulus and elongation) suitable for the application of final products.…”

“…Poly(amic acid) (PAA) derivatives are the most commercially available PSPI for microelectronic fabrication. [6][7][8][9][10] TSPSPs should meet both of the following two requirements: precise photosensitive pattern formation properties and moderate mechanical endurances (i.e., tensile strength, Young's modulus and elongation) suitable for the application of final products. Positive-tone TSPSPs are much more favorable than negative tones for wire-bonding process because of the V-type pattern shape instead of swelling pattern.…”

Low-Temperature-Curable and Positive-Type Photosensitive Polyimide with High Mechanical Strength, High Resolution and Good Pot-Life Based on Chain Extendable Poly(Amic Acid), Thermal Degradable Crosslinker, Chain Extender, Thermal Base Generator and Photoacid Generator

“…Polyimides (PIs) are topnotch constructing polymers, which are widely used as buffer coatings, passivation layers and insulation layers, for the redistribution in microelectronics, due to their exceptional thermal stabilities and excellent mechanical performances [1][2][3][4][5]. To obtain the miniaturization properties in most of the applications, adoption of photolithography techniques is highly required [6][7][8][9][10]. The conventional photolithographic process widely used in this area is to make a PI pattern by etching via a photoresist pattern.…”