Alkali Silicate Glass Coatings for Mitigating the Risks of Tin Whiskers

Hillman, D.; Wilcoxon, Ross; Lower, Nathan P.; Grossman, D. M.

doi:10.1007/s11664-015-4057-1

Cited by 4 publications

(3 citation statements)

References 7 publications

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“…The low-temperature processing does not introduce any mechanical stress into the substrate, one of the concurring causes for whiskers formation and growth; furthermore, the coating is chemically inert and can sustain large temperature variations without modification to its properties. On the other hand, parylene is not reworkable and it has been reported to have delamination issues on several materials (e.g., ceramic materials) [27]; it was also shown to fail at tin whisker mitigation in 1000-4000 h 85 ºC/85% RH tests [28].…”

Section: Introductionmentioning

confidence: 99%

Atomic layer deposition (ALD) for environmental protection and whisker mitigation of electronic assemblies

et al. 2021

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In this study, we demonstrate how metal-oxide thin-film conformal coatings grown by atomic layer deposition (ALD) can be exploited as an effective approach to mitigate tin whisker growth on printed circuit boards. First, we study the effect of different ALD coatings and process parameters on Sn–Cu-electroplated test coupons, by combining optical imaging and scanning electron microscopy and evaluating whisker distribution on the surface. On these samples, we found that one important parameter in mitigating whisker growth is the time interval between electroplating and the ALD coating process (pre-coat time), which should be kept of the order of few days (2, based on our results). Atomic layer-deposited coatings were also found to be effective toward whisker formation in different storage conditions. Furthermore, we show that ALD coating is also effective in limiting the need for outgassing of electronic assemblies (PCBAs), which is an additional stringent requirement for applications in space industry. Our experimental results thus demonstrated that atomic layer deposition is a suitable technique for aerospace applications, both in terms of degassing and whisker mitigation.

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Section: Introductionmentioning

confidence: 99%

Atomic layer deposition (ALD) for environmental protection and whisker mitigation of electronic assemblies

et al. 2021

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“…Sodium silicate solutions, also known as waterglass, have been used as an inorganic binder for a number of adhesives, 27 sealants, 28 and electronic packaging technologies. 29 Previously, we have demonstrated the ability to form glass composites using sodium silicate chemistry as an electronic packaging material for heterogeneous integration. 30 Building on this work, we hypothesized that, by tuning the rheology of our material system, we could generate materials that could be printed using DIW.…”

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confidence: 99%

“…Sodium silicate solutions, also known as waterglass, have been used as an inorganic binder for a number of adhesives, sealants, and electronic packaging technologies . Previously, we have demonstrated the ability to form glass composites using sodium silicate chemistry as an electronic packaging material for heterogeneous integration .…”

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confidence: 99%

Low-Temperature Additive Manufacturing of Silica Glass Composites

Duncan,

Beck,

Miller

et al. 2024

ACS Materials Lett.

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Additive manufacturing has revolutionized the ability to prototype and manufacture complex structures. A shortcoming of many additive manufacturing processes is the reliance on organic materials that are not durable long-term, in many cases being both chemically and thermally unstable. Conversely, additive manufacturing approaches that feature more-robust inorganic materials require expensive and high-temperature (>1000 °C) processing steps, which often limits their final use to one single function. Here, we describe a materials platform that enables the additive manufacturing of inorganic glass composite structures at low temperatures (<250 °C), with chemical and thermal stability comparable to traditional silicon dioxide-based materials. Due to the low temperature processing, a wide range of materials (dielectrics, metals, optical) can be embedded into the glass to create multifunctional glass structures. Since no specialized tooling is needed and the source materials are commercially available, we expect this approach to be easily adopted for prototyping glass/ceramic objects and structures.

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