Alignment-Independent Chip-to-Chip Communication for Sensor Applications Using Passive Capacitive Signaling

Lin, Yi‐Hsien; Sylvester, Dennis; Blaauw, David

doi:10.1109/jssc.2009.2014024

Cited by 6 publications

(2 citation statements)

References 19 publications

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“…This prevents the use of techniques that attempt to sense an undriven capacitance in order to determine alignment [18], which are applied when power delivery to the target chip is not possible. Since power can be delivered to the target chip in this case, it makes sense to use the existing transmitter circuitry in the target cell to drive a stimulus (e.g., clock) onto the target plate to electrically distinguish it from the ground plane.…”

Section: A Alignment Sensingmentioning

confidence: 99%

“…They also require link quality to be inferred from alignment data, instead of directly measuring it, a relatively costly operation within the context of low-power devices having limited memory and processor resources. Other work [18] has been done with the alignment sensor sharing the same array as the communication circuitry, but the application targeted (a single Mbps link, with power delivery handled by the same array) and the type of alignment sensor used (a ring oscillator and counter under each plate in the array) mean that its data rate density and power efficiency are not appropriate for use in Origami implants. This paper proposes a system where the alignment sensors share plates with the communication array, and so avoids the need for link quality inference calculation and limits the area of alignment between the two chips to the communication array only.…”

Section: Introductionmentioning

confidence: 99%

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Capacitive Proximity Communication With Distributed Alignment Sensing for Origami Biomedical Implants

Loh

Emami

2015

IEEE J. Solid-State Circuits

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Origami implant design is a 3D integration technique which addresses size and cost constraints in biomedical implants. This paper presents a capacitive proximity interconnect scheme that enables chip-to-chip communication across folds in the Origami implant, allowing increased flexibility of chip placement and orientation. The capacitive plate array senses link quality and chip-to-chip alignment, and adapts the data rate at each plate accordingly, shutting down poorly-coupled links to save power. Instead of using separate plate arrays for alignment sensing and communication, this interconnect embeds the alignment sensor and transceiver arrays within the same set of plates, so that link quality can be measured at the communications plates directly, thus simplifying their adaptation to alignment. In order to save power and area, the sensor circuitry is distributed across the array and shares functional blocks with the transceiver. Data rates from 10-60 Mbps are achieved over 4-12 µm of parylene-C, with efficiencies up to 0.180 pJ/bit.

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Section: A Alignment Sensingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Capacitive Proximity Communication With Distributed Alignment Sensing for Origami Biomedical Implants

Loh

Emami

2015

IEEE J. Solid-State Circuits

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A robust contactless capacitive communication link for high power battery systems

Wenger

Filimon

Lorentz

et al. 2014

2014 IEEE 23rd International Symposium on Industrial Electronics (ISIE)

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Large Li-ion battery systems are being used in a growing number of applications. Due to lack of standards and various requirements, the battery systems have to be specifically designed for each application. This need for a specific design also affects the battery monitoring circuit. In order to reduce design effort, distributed battery monitoring systems integrated into the cells were proposed. Economies of scale allow these circuits to be produced at low cost per unit as they will be needed in every single battery cell. One of the major challenges of the distributed battery monitoring concept is the communication link for the monitoring circuits: it has to be robust, reliable, and easy to install. As a possible solution, a capacitively coupled data transmission link for a battery system consisting of up to 100 smart battery cells is investigated by simulation and experiment. Relevant influence factors of the physical implementation on a capacitive voltage divider determining the transmitted data signal are identified and evaluated, considering application specific constraints. As a result, a suitable signal conditioning circuit using frequency shift keying (FSK) modulation is proposed and experimental results obtained with a prototype implementation of the proposed circuit are presented

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A test probe for TSV using resonant inductive coupling

Rashidzadeh

Basith

2013

Proceedings of the 2013 25th International Teletraffic Congress (ITC)

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Alignment-Independent Chip-to-Chip Communication for Sensor Applications Using Passive Capacitive Signaling

Cited by 6 publications

References 19 publications

Capacitive Proximity Communication With Distributed Alignment Sensing for Origami Biomedical Implants

Capacitive Proximity Communication With Distributed Alignment Sensing for Origami Biomedical Implants

A robust contactless capacitive communication link for high power battery systems

A test probe for TSV using resonant inductive coupling

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