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Kolodii, B. I.

doi:10.1023/a:1011343022972

Cited by 14 publications

(6 citation statements)

References 3 publications

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“…Certain features of surface morphology, particularly, its roughness, may result in the electron redistribution. They can be caused by dislocations, 48 stress induced spots of different structure phases, 49 or general electric deformation coupling 50 in combination with stress induced buckling. 51,52 Local charges due to stress induced oxide cracking or ion trapping under the whisker growing layer (say, Sn on Cu substrate) are conceivable sources of the above considered surface electric fields as well.…”

Section: The Electric Field Distributionmentioning

confidence: 99%

Electrostatic Theory of Metal Whiskers

Карпов

2014

Phys. Rev. Applied

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Metal whiskers often grow across leads of electric equipment and electronic package causing current leakage or short circuits and raising significant reliability issues. The nature of metal whiskers remains a mystery after several decades of research. Here, the existence of metal whiskers is attributed to the energy gain due to electrostatic polarization of metal filaments in the electric field. The field is induced by surface imperfections: contaminations, oxide states, grain boundaries, etc. A proposed theory provides closed form expressions and quantitative estimates for the whisker nucleation and growth rates, explains the range of whisker parameters and effects of external biasing, and predicts statistical distribution of their lengths.

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Section: The Electric Field Distributionmentioning

confidence: 99%

Electrostatic Theory of Metal Whiskers

Карпов

2014

Phys. Rev. Applied

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“…Previous theoretical study has not been well established the relationship between electrostatic potential (or corrosion potential) and mechanical deformation. According to previous studies of the influence of deformation on the electron gas of a metal, it is possible to qualitatively predict changes in the electrode potential [41] and hence to estimate the effect of deformation on the corrosion potential. Experimental data showed rather complicated relationship and experimental studies have shown that a simple relationship between stress and corrosion parameters does not exist [42].…”

Section: Resultsmentioning

confidence: 99%

Strain Effect on Electronic Structure and Work Function in α-Fe2O3 Films

Chen

Shi

et al. 2017

Materials

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We investigate the electronic structure and work function modulation of α-Fe2O3 films by strain based on the density functional method. We find that the band gap of clean α-Fe2O3 films is a function of the strain and is influenced significantly by the element termination on the surface. The px and py orbitals keep close to Fermi level and account for a pronounced narrowing band gap under compressive strain, while unoccupied dz2 orbitals from conduction band minimum draw nearer to Fermi level and are responsible for the pronounced narrowing band gap under tensile strain. The spin polarized surface state, arising from localized dangling-bond states, is insensitive to strain, while the bulk band, especially for pz orbital, arising from extended Bloch states, is very sensitive to strain, which plays an important role for work function decreasing (increasing) under compressive (tensile) strain in Fe termination films. In particular, the work function in O terminated films is insensitive to strain because pz orbitals are less sensitive to strain than that of Fe termination films. Our findings confirm that the strain is an effective means to manipulate electronic structures and corrosion potential.

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“…In particular, it was shown that mechanical stresses generally strongly affect metal surface corrosion rates, which observation points at the stress induced change of the surface electric potential. These changes can be caused by dislocations, 36 stress induced spots of different structure phases, 37 or general electric deformation coupling 38 in combination with stress induced buckling. 39,40 Local charges due to stress induced oxide cracking on or ion trapping under the whisker growing metal layer (say, Sn on Cu substrate) are conceivable sources of the above considered surface electric fields as well.…”

Section: Numerical Estimates and Discussionmentioning

confidence: 99%

Nucleation and growth of metal whiskers

Karpov

2013

Preprint

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The existence of metal whiskers is attributed to the energy gain due to electrostatic polarization of needle shaped metal filaments in the electric field induced by surface imperfections: contaminations, oxide states, etc. A proposed theory provides closed form expressions for the whisker nucleation and growth rates, explains the range of whisker parameters and effects of external biasing. It predicts a well controlled whisker growth on any metal surface via generating surface plasmon polariton excitations.

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Cited by 14 publications

References 3 publications

Electrostatic Theory of Metal Whiskers

Electrostatic Theory of Metal Whiskers

Strain Effect on Electronic Structure and Work Function in α-Fe2O3 Films

Nucleation and growth of metal whiskers

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