AlxTayOz Mixture Coatings Prepared Using Atomic Layer Deposition for Corrosion Protection of Steel

Härkönen, Emma; Díaz, Belén; Światowska, Jolanta; Maurice, Vincent; Seyeux, Antoine; Fenker, M.; Tóth, Lajos; Radnóczi, G.; Marcus, Philippe; Ritala, Mikko

doi:10.1002/cvde.201207028

Cited by 15 publications

(13 citation statements)

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“…The detection of Cl − ions in the bulk coatings may be due to trace chlorine contamination of the TMA precursor, as already discussed for alumina coatings 38,41 and shown to be below the detection limit of XPS. 37 On the extreme surface and at the interface, the Cl − ions may come from exposure to the ambient before and after the deposition of the coating.…”

Section: Resultsmentioning

confidence: 90%

Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition

Mirhashemihaghighi

Światowska

Maurice

et al. 2015

J. Electrochem. Soc.

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Corrosion protection by ultra-thin (≤ 50 nm) alumina films deposited by atomic layer deposition (ALD) on copper at 250 • C was studied in 0.5 M NaCl aqueous solution by combining electrochemical and surface analytical methods. Time-of-Flight Secondary Ion Mass Spectrometry revealed a homogenous in-depth stoichiometry of the alumina coatings and their residual bulk contamination by organic and water precursor fragments. Trace contamination by a spurious Cu oxide was evidenced at the interface with the Cu substrate despite a reducing pre-treatment. Atomic force microscopy images revealed conformal substrate coverage and a granularlike coating morphology at the nanometer scale. Linear Sweep Voltammetry (LSV) and Electrochemical Impedance Spectroscopy (EIS) showed no electrochemical activity of the coating and a corrosion decrease reaching 4 orders of magnitude for coated samples in comparison with bare copper. Uncoated surface fraction was quantified by application of three different methods using the LSV and EIS data which led to results in excellent agreement. The uncoated surface fraction for 50 nm Al 2 O 3 layers was ∼0.01%, confirming ALD alumina as an excellent coating for corrosion protection with spectacularly low residual corrosion activity restricted to the bottom of channel defects connecting the substrate to environment through the coating.Copper is an important engineering metal and finds widespread application in heat exchangers, electrical power lines, water utilities, oil refineries, marine environments and microelectronics owing to its high electrical and thermal conductivity and mechanical workability. 1-3 Many studies have been dedicated to the copper corrosion mechanisms, especially in presence of aggressive ions like chloride, 4-8 and various corrosion protection methods have been explored including coating techniques such as Chemical Vapor Deposition (CVD), 9,10 plasma deposition 11 or electrochemical polymerization, 12 and the use of inhibitors 13-16 or self-assembled monolayers. 17,18 In the present study, Atomic Layer Deposition (ALD) of ultra-thin (≤ 50 nm) alumina coatings has been investigated for the corrosion protection of copper. ALD, as a CVD derived method, is an ideal technique for growing high quality nanometer-thick films. It takes advantage of sequential precursor pulsing on the substrate with selflimiting saturative steps to produce conformal films with accurate thickness control. As a result of excellent step-coverage on even difficult substrate surfaces with high aspect ratios, the grown films tend to be conformal and pinhole-free. [19][20][21][22] Alumina (Al 2 O 3 ) was chosen as a well-behaved and thoroughly-studied ALD material by virtue of its high dielectric properties, good adhesion to many surfaces, amorphous structure, thermal stability and mechanical properties. 21,23-25 ALD alumina for corrosion protection has already been studied alone and/or in combination with titania on stainless steel, 23,26-28 Mg alloy, 29 Al alloy, 30 silver 31,32 and copper. 33-36 Nanolamina...

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Section: Resultsmentioning

confidence: 90%

Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition

Mirhashemihaghighi

Światowska

Maurice

et al. 2015

J. Electrochem. Soc.

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“…ALD is also used extensively by the microelectronics industry for deposition of high- [58], metallization [59] and MEMS devices [60,61] . New technologies are also being developed which can utilize the advantages of ALD on industrial scale in more mundane applications such as strengthening of glass [62], gas and moisture barrier coatings [63][64][65] and corrosion protection [66,67].…”

Section: Atomic Layer Depositionmentioning

confidence: 99%

Optical Properties of Vanadium Pentoxide Deposited by ALD

2012

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“…Promising results have been obtained with coatings combining the barrier properties of Al 2 O 3 wit h th e chem ical stabi lity of Ti O 2 o r Ta 2 O 5 . 19,23,24,28,[30][31][32]36 However, the growth of ALD thin films is relatively slow, and thus only coatings with submicrometer thicknesses are economically feasible to produce. Because thicker layers are needed against erosive loads, the range of applications for solely ALD based protective coatings is limited.…”

Section: Introductionmentioning

confidence: 99%

“…Shan et al 37 have shown that the corrosion protection properties of magnetron sputtered CrN coatings on stainless steel can indeed be improved with ALD TiO 2 thin films. Marin et al 38 28,30,31,40 ALD Al 2 O 3 is an excellent insulator and nucleates well on various kinds of surfaces, 26,28 but does not provide sufficient durability against a chemical attack. 27 ALD Ta 2 O 5 , on the other hand, is chemically stable, but does not nucleate as well as Al 2 O 3 .…”

Section: Introductionmentioning

confidence: 99%

“…28,29 Carefully optimized combination of the two materials into nanolaminates or mixtures has been shown to provide good barrier properties with sufficient durability against chemical attack. 28,30 The influence of the ALD sealing to corrosion protection properties was studied with electrochemical methods and neutral salt spray (NSS) testing. Additionally, the morphology and in-depth composition of the combined coatings were examined to gain insight into the mechanism behind the improved corrosion durability.…”

Section: Introductionmentioning

confidence: 99%

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Sealing of Hard CrN and DLC Coatings with Atomic Layer Deposition

Härkönen

Kolev

Díaz

et al. 2014

ACS Appl. Mater. Interfaces

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Atomic layer deposition (ALD) is a thin film deposition technique that is based on alternating and saturating surface reactions of two or more gaseous precursors. The excellent conformality of ALD thin films can be exploited for sealing defects in coatings made by other techniques. Here the corrosion protection properties of hard CrN and diamond-like carbon (DLC) coatings on low alloy steel were improved by ALD sealing with 50 nm thick layers consisting of Al2O3 and Ta2O5 nanolaminates or mixtures. In cross sectional images the ALD layers were found to follow the surface morphology of the CrN coatings uniformly. Furthermore, ALD growth into the pinholes of the CrN coating was verified. In electrochemical measurements the ALD sealing was found to decrease the current density of the CrN coated steel by over 2 orders of magnitude. The neutral salt spray (NSS) durability was also improved: on the best samples the appearance of corrosion spots was delayed from 2 to 168 h. On DLC coatings the adhesion of the ALD sealing layers was weaker, but still clear improvement in NSS durability was achieved indicating sealing of the pinholes.

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Al_xTa_yO_z Mixture Coatings Prepared Using Atomic Layer Deposition for Corrosion Protection of Steel

Cited by 15 publications

References 50 publications

Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition

Electrochemical and Surface Analysis of the Corrosion Protection of Copper by Nanometer-Thick Alumina Coatings Prepared by Atomic Layer Deposition

Optical Properties of Vanadium Pentoxide Deposited by ALD

Sealing of Hard CrN and DLC Coatings with Atomic Layer Deposition

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