Al/SiC baseplate hybrid power modules: evaluation of the thermomechanical performances

Abstract

This paper deals with an evaluation of the performances of hybrid power modules using AvSiC Metal Matrix Composite (MMC) baseplates. In this study, we analyse the possible damage in the assemblies by measuring their thermal resistance. Results show that even after 2700 thermal shocks, only a very small increase of the thermal resistance of the assemblies is observed In comparison, modules with copper baseplates show a strong increase of the thermal resistance and fail well before. As a consequence, in applications where thermal cycling is involved, hybrid power modules with AVSiC MMC baseplates will offer a much better reliability. SEM observations conducted on cross-sectioned samples do not show the typical cracks generally observed in solder joints between the Direct Bonded Copper (DBC) ceramic substrate and the copper baseplate of aged modules.

Performance and application of SiCp/Al composites for electronic packaging

“…Aluminum matrix composites reinforced with high volume fraction of SiC particles provide a novel solution to electronic packaging and thermal management applications[I, 4,5], because of their high thermal conductivity, compatible and tailaborable CTEs, lightweight, enhanced specific strength and modulus. It has been reported that the lifetime limitation of hybrid power modules can be improved more than 10 times by replacing copper baseplate with SiCp/AI composite [6].…”