Al-Cu interconnect corrosion prevention in post metal etch and wet polymer clean wafers

Wai, Wan Tatt; Ling, Ng Cheah

doi:10.23919/mipro.2017.7966547

2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) 2017

DOI: 10.23919/mipro.2017.7966547

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Al-Cu interconnect corrosion prevention in post metal etch and wet polymer clean wafers

Wan Tatt Wai

Ng Cheah Ling

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Al-Cu interconnect corrosion prevention in post metal etch and wet polymer clean wafers

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