Air stable copper-silver core-shell submicron particles: Synthesis and conductive ink formulation

Pajor-Świerzy, Anna; Farraj, Yousef; Kamyshny, Alexander; Magdassi, Shlomo

doi:10.1016/j.colsurfa.2016.08.026

Cited by 36 publications

(31 citation statements)

References 35 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…On the other hand, copper has excellent electrical properties, but copper nanoparticles are highly susceptible to oxidation in ambient environment at elevated temperatures. Pajor-Świerzy et al [152] reported on the synthesis of a low-cost conductive Cu-Ag core-shell nanoparticle ink for printed electronics applications. Thus, copper nanoparticles are not very ideal for printed electronics applications.…”

Section: Cu-ag Core-shell Bimetallic Nanoparticle Inksmentioning

confidence: 99%

“…Genes'Ink) [144] • Genes'Ink [144] • Suganthi et al [141] • Helioś Ink • H-SZ01034, Genes'Ink semiconductive ink [144] Core-shell bimetallic nanoparticle inks Cu-Ag Core-shell bimetallic nanoparticle inks • Not available • Better electrical properties and oxidation stability as compared to copper nanoparticles under ambient conditions • Potentially lower material costs as compared to silver nanoparticle inks due to reduced silver loading [146] • Lower initial sintering temperature as compare to copper nanoparticle inks [155] • °C [152] • Achieving 12 µΩ cm at 350 °C [146] • Pajor-S ′ wierzy et al [152] • Grouchko et al [153] • Lee et al [146] • Not commercially available …”

Section: Bq321 - Screenmentioning

confidence: 99%

“…Hence, with Cu–Ag core–shells BNP, it is possible to significantly reduce the silver load in nanoparticles to enjoy better cost savings while maintaining similar electrical conductivities . There is literature demonstrating successful uses of Cu–Ag core–shell BNP inks for 3D printed electronics applications. These Cu–Ag core–shell BNP inks demonstrate good electromigration and oxidation resistance properties.…”

Section: Core–shell Bimetallic Nanoparticle Inksmentioning

confidence: 99%

See 2 more Smart Citations

Metallic Nanoparticle Inks for 3D Printing of Electronics

Tan

Chua

et al. 2019

Adv Elect Materials

196

100

View full text Add to dashboard Cite

Metallic nanoparticle inks are readily obtainable from the commercial market and are commonly used for fabricating conductive tracks and patterns due to their relatively higher electrical conductivity as compared to other types of inks. These metallic nanoparticle inks are made up of electrically conductive metallic nanoparticles suspended in liquid mediums, with particle size ranging from 1 to 100 nm. However, there are also diverse types of metallic nanoparticle inks in the market (for instance, silver nanoparticle inks, gold nanoparticle inks, and copper nanoparticle inks). Metallic nanoparticle inks of different material compositions can directly influence the final electrical, material, and mechanical properties of the printed patterns. This paper presents an overview of the different types of metallic nanoparticle inks used for the 3D printing of electronics. The strengths and weaknesses of each type of ink are critically reviewed. The challenges and potentials of metallic nanoparticle inks in 3D printed electronics are also discussed. Metallic Nanoparticle InksMetallic nanoparticle inks are suspensions of metallic nanoparticles in liquid mediums (see Figure 2a), in which individual metallic nanoparticle is encapsulated in a layer of insulating organic additives and stabilizing agents (see Figure 2b). The encapsulating organic additives and stabilizing agents help prevent the metallic nanoparticles from agglomeration, but at the same time, also impede the flow of electrons from particles to particles. Therefore, sintering processes are required to remove The three-dimensional (3D) printed electronics additive manufacturing industry sector has grown substantially in the past few years, and there is increasing demand for different types of metallic nanoparticle inks in electronics printing for various applications. Metallic nanoparticle inks are commonly used for fabricating conductive tracks and patterns due to their relatively high electrical conductivity as compared to other types of inks, and they can be further categorized into single-element metallic nanoparticle inks, alloy metallic nanoparticle inks, metallic oxide nanoparticle inks, and core-shell bimetallic nanoparticle (BNP) inks. It is critical to gain a deep understanding of the metallic nanoparticle inks used in 3D printed electronics as the material properties of these inks can directly affect the final electrical and mechanical properties of the printed patterns. This review presents an overview of the available metallic nanoparticle inks used for 3D printing of electronics, and critically reviews the strengths and weaknesses of each type of ink. Finally, the challenges of metallic nanoparticle inks in 3D printed electronics are also discussed along with the future outlook for 3D printed electronics.

show abstract

Section: Cu-ag Core-shell Bimetallic Nanoparticle Inksmentioning

confidence: 99%

Section: Bq321 - Screenmentioning

confidence: 99%

Section: Core–shell Bimetallic Nanoparticle Inksmentioning

confidence: 99%

See 1 more Smart Citation

Metallic Nanoparticle Inks for 3D Printing of Electronics

Tan

Chua

et al. 2019

Adv Elect Materials

196

100

View full text Add to dashboard Cite

show abstract

“…Yim et al 40 fabricated hybrid copper-silver-graphene (CSG) nanoplatelet conductive inks which showed the desired oxidation resistance even at high temperatures. This CSG lm displayed an electrical resistance of a few ohms at 190 C. Pajor-Swierzy et al 41 recently presented a kind of conductive ink based on Cu and Ag core-shell particles. It was air stable with a lowest resistivity of 6.9 AE 0.7 mU cm that corresponds to 25% of the conductivity of bulk Cu.…”

Section: Stabilization Against Oxidationmentioning

confidence: 99%

Printed electronics based on inorganic conductive nanomaterials and their applications in intelligent food packaging

2019

View full text Add to dashboard Cite

show abstract

“…They are widely used in the fields of advanced materials, medicine and bionics . Extensive literature has focused on the preparation of core‐shell composite particles and microcapsules, among which the layer by layer (LBL) self‐assembly method and the template method are most common . However, the former has the disadvantages of experiencing complicated procedures and requiring superb experimental operation.…”

Section: Introductionmentioning

confidence: 99%

A Facile Route to Prepare PMMA/SiO₂ Core‐Shell Particles and PMMA Microcapsules via Sonochemical Graft Polymerization

Guo

Wang

et al. 2019

ChemistrySelect

View full text Add to dashboard Cite

Ultrasonically initiated graft polymerization is employed to prepare poly (methyl methacrylate)/silicon dioxide (PMMA/SiO2) core‐shell particles and PMMA microcapsules. Monodisperse SiO2 particles are obtained by the Stöber method. Its surface is modified with γ‐methacryloxypropyl trimethoxy silane (MPS) to introduce unsaturated double bonds. And then MMA and MPS are copolymerized under ultrasonic initiation to prepare PMMA/SiO2 core‐shell particles. PMMA microcapsules are obtained by etching SiO2 with the HF aqueous solution. The morphology and size of the core‐shell particles and polymer microcapsules are analysed using transmission electron microscopy (TEM) and dynamic light scattering (DLS). The encapsulation state is determined using a Fourier transform infrared spectrometer (FTIR) and X‐ray photoelectron spectrometer (XPS). The results show that both the core‐shell particles and the polymer microcapsules have perfect core‐shell or hollow structures. The control of shell thickness can be easily realized by adjusting the amount of monomer, e. g. 30 nm, 50 nm and 80 nm, respectively. And in the inner of the shell, PMMA is anchored onto the surface of SiO2 core with covalent bonds. As the monomer amount increases, the contents of Si, O, and C change accordingly. And the polymer shell would become denser and thicker.

show abstract

Air stable copper-silver core-shell submicron particles: Synthesis and conductive ink formulation

Cited by 36 publications

References 35 publications

Metallic Nanoparticle Inks for 3D Printing of Electronics

Metallic Nanoparticle Inks for 3D Printing of Electronics

Printed electronics based on inorganic conductive nanomaterials and their applications in intelligent food packaging

A Facile Route to Prepare PMMA/SiO₂ Core‐Shell Particles and PMMA Microcapsules via Sonochemical Graft Polymerization

Contact Info

Product

Resources

About

Air stable copper-silver core-shell submicron particles: Synthesis and conductive ink formulation

Cited by 36 publications

References 35 publications

Metallic Nanoparticle Inks for 3D Printing of Electronics

Metallic Nanoparticle Inks for 3D Printing of Electronics

Printed electronics based on inorganic conductive nanomaterials and their applications in intelligent food packaging

A Facile Route to Prepare PMMA/SiO2 Core‐Shell Particles and PMMA Microcapsules via Sonochemical Graft Polymerization

Contact Info

Product

Resources

About

A Facile Route to Prepare PMMA/SiO₂ Core‐Shell Particles and PMMA Microcapsules via Sonochemical Graft Polymerization