“…Thermal contact resistance between an impacting particle and a non-heated solid substrate has been attributed to the presence of volatile compounds on the surface, which evaporate under the hot splat and form a gaseous barrier between the two surfaces [2,5,34,35]. On heated or preheated surfaces, these adsorbates/condensates are almost completely vaporized [2,5,7,36], improving splat-substrate contact and greatly reducing the thermal contact resistance at the splat-substrate interface.…”