2020
DOI: 10.1007/s10854-020-03730-y
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Aging characteristic of Cu-doped nickel manganite NTC ceramics

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Cited by 14 publications
(8 citation statements)
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“…The ∆R/R should be as small as possibleto maintain the reproducibility of the thermistor parameters such as ρ 25 and B 25/85 . In this work, the ∆R/R was 5.65% for S1 ceramics (Table 4), which is comparable to that of the Cu 0.3 Ni 0.66 Mn 2.04 O 4 bulks derived from mixed oxalate powder [43] but much lower than those of conventional Cu-doped nickel manganites [6,44]. The underlying mechanism of resistance driftin Cucontaining nickel manganites generally involves cationic oxidation and cationic migration from the A sites to the B sites in the spinel structure [45,46].…”
Section: Electrical Properties Of Sintered Ceramicssupporting
confidence: 66%
See 1 more Smart Citation
“…The ∆R/R should be as small as possibleto maintain the reproducibility of the thermistor parameters such as ρ 25 and B 25/85 . In this work, the ∆R/R was 5.65% for S1 ceramics (Table 4), which is comparable to that of the Cu 0.3 Ni 0.66 Mn 2.04 O 4 bulks derived from mixed oxalate powder [43] but much lower than those of conventional Cu-doped nickel manganites [6,44]. The underlying mechanism of resistance driftin Cucontaining nickel manganites generally involves cationic oxidation and cationic migration from the A sites to the B sites in the spinel structure [45,46].…”
Section: Electrical Properties Of Sintered Ceramicssupporting
confidence: 66%
“…Particularly, the Cu + ions at the A sites oxidize to Cu 2+ during aging (heating in an air atmosphere), which results in the migration of Cu ions from the A sites to the B sites. This ion migration decreases the Mn 4+ content, and therefore leads to an increase in resistance [ 44 , 47 ]. In our case, the relative low aging coefficient of S1 is possibly because of an increase in the concentration of Cu 2+ ion and a decrease in the concentration of Cu + ion in the pristine ceramics due to the relatively low sintering temperature [ 43 ].…”
Section: Resultsmentioning
confidence: 99%
“…A serious problem of NTC thermistors in practical applications is that their electrical resistance drifts over time, which is known as aging. The aging mechanism is still unclear, and several phenomena have been used to try to explain this aging, including redistribution of cations, disproportionation between trivalent and tetravalent Mn cations, changes in the oxidation state of Mn cations, reaggregation of cations and electrons, and reconfiguration of the electrode/ceramic interface 29 . The aging phenomenon contributes to the inferior electrical stability and reproducibility of ceramics, which affects the long-term stability of temperature sensors.…”
Section: Resultsmentioning
confidence: 99%
“…Obviously, the ΔR/R indicates poor electrical stability of films with Cu-rich compositions. In a very recent article, the Cu was reported to cause a remarkable resistance drift up to 33% in Ni 0.7 Mn 2.3-x Cu x O 2 ceramics upon heating at 300°C [29]. Since electrical stability is one of the crucial technical parameters for ensuring the reliability of ultimate devices, the aging characteristic is necessary to improve.…”
Section: Microstructure and Electrical Properties Of Cu-doped (Nimn) 3 O 4 Thin Filmsmentioning
confidence: 99%