Ag wire and Ag alloy wire reliability and molding compounds

Abstract

Ag wire and Ag alloy wire reliability experiments were conducted on both 28-lead SOP and 96-pin PBGA packages. Biased HAST (b-HAST) of Ag-wired packages with higher ion content molding compouds generated obvious defects promoted by ion accumulation mechanism. Intermetallic compounds (IMCs) at the corroded interface are identified using cross-sectional TEM/EDX. Ion selective affinity of intermetallic compound is rationalized using ab initio molecular dynamics simulation.

A Review of Silver Wire Bonding Techniques

“…They also proposed guidelines that, by providing a predetermined current density, the surface quality of silver thin wires could be effectively improved, with the hope of improving the electrical reliability and service life of silver thin wires in electronic devices. Mizushima et al [77] proposed that ionic impurities could promote metal corrosion in microelectronic packaging. They demonstrated the mechanism of ion-induced corrosion via the destruction detection of corroded intermetallic compounds and atomic simulation.…”