Aerosol-Printed Highly Conductive Ag Transmission Lines for Flexible Electronic Devices

Abt, Marvin; Roch, Aljoscha; Qayyum, Jubaid Abdul; Pestotnik, Svenja; Stepien, Lukas; Abu-Ageel, Atef; Wright, Brian; Ulusoy, Ahmet Çağrı; Albrecht, John D.; Harle, Lee; Papapolymerou, John; Schuelke, Thomas

doi:10.1109/tcpmt.2018.2869977

Cited by 31 publications

(15 citation statements)

References 31 publications

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“…Beyond 40 GHz, it can be observed that the simulated losses are lower than the measured losses by around 2 dB, which is attributed to the inhomogeneity of the printed ink layer. Previously reported characterizations of printed lines in the mmWave range also exhibited discrepancies of over 5 dB beyond 30 GHz [23]. The conductivity of the silver layers in the CST model is σ = 1×10 5 S/m with a surface roughness of 25 μm.…”

Section: Millimeter-wave Dc-blocking Microstrip Line a Capacitor-impregnated Microstrip Design And Characterizationmentioning

confidence: 95%

“…Although a screen-printed textile-based mmWave antenna was recently demonstrated at 77 GHz [5], all reported textile-based transmission measurements of textile-based printed transmission lines were limited to sub-10 GHz measurements [21]. To illustrate, while several aerosol-jetted lines were characterized up to 110 GHz [22], [23], such implementations are only possible on smooth and homogeneous substrates with high thermal reliability, such as LCP and polyimide, and are not suitable for use with rough substrates such as conventional fabrics and paper. In addition, the mechanical reliability of such implementations against repeated bending, typical for wearables, was not explored.…”

Section: Introductionmentioning

confidence: 99%

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Screen-Printable Flexible Textile-Based Ultra-Broadband Millimeter-Wave DC-Blocking Transmission Lines Based on Microstrip-Embedded Printed Capacitors

2022

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In this paper, a novel multi-layered microstrip line with built-in parallel-plate capacitors is proposed for DC-blocking applications, with its transmission characteristics measured up to 50 GHz. The microstrip lines are fabricated via screen printing directly onto polyurethane films laminated on standard textile substrates which would otherwise be unsuitable for printing. Compared to a standard microstrip line on the same substrate, the proposed 10 cm-long line on felt (with an embedded 44 pF capacitance) suffers from less than 0.1 dB higher insertion loss up to 4 GHz. Furthermore, varying the overlapping length of the lines and hence the capacitance enables the realization of DC blocking and −3 dB high-pass filtering with pass-bands starting between 88 MHz and 1.2 GHz. This is achieved without altering the cut-off frequency of the microstrip line's mode-free propagation, measured up to 50 GHz, exhibiting a low attenuation of 0.32 dB/mm at 50 GHz on a felt fabric substrate. Compared to a lumped capacitor, the proposed microstripembedded printed capacitor demonstrates a significant improvement in mechanical reliability, withstanding over 10,000 bending cycles, and RF power handling with under 6 • C temperature rise at 1 W. The lines are fabricated on two textile substrates and their transmission characteristics were measured up to 50 GHz, which represents the highest frequency characterization of textile-based lines to date, demonstrating a stable group delay and insertion losses. Based on the proposed multi-layered integration method, low-cost screen-printed microstrip-embedded capacitors on textiles can be used for microwave applications up to mmWave bands.INDEX TERMS Additive manufacturing, capacitors, DC block, high-pass filter, microstrip lines, printed capacitors, radio frequency (RF), textile capacitors, transmission lines.This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination.

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Section: Millimeter-wave Dc-blocking Microstrip Line a Capacitor-impregnated Microstrip Design And Characterizationmentioning

confidence: 95%

Section: Introductionmentioning

confidence: 99%

Screen-Printable Flexible Textile-Based Ultra-Broadband Millimeter-Wave DC-Blocking Transmission Lines Based on Microstrip-Embedded Printed Capacitors

2022

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“…A coupled line filter at 25 GHz and dipole antenna at Ka-band were printed with silver particles in 2013 and 2014, respectively [29,30]; however, the conductor loss is non-negligible as the frequency increases. To minimize the conductor loss, highly conductive silver layers and lithography-inkjet printing hybrid methods have been investigated [32][33][34], showing reasonable loss up to 110 GHz for the transmission lines. Another big concern with inkjet printing is the degradation of conductor loss with the bending effect, which has been studied in [31].…”

Section: Fabrication Of Lcp Devicesmentioning

confidence: 99%

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Zhou

Qian

et al. 2022

Molecules

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With the emergence of fifth-generation (5G) cellular networks, millimeter-wave (mmW) and terahertz (THz) frequencies have attracted ever-growing interest for advanced wireless applications. The traditional printed circuit board materials have become uncompetitive at such high frequencies due to their high dielectric loss and large water absorption rates. As a promising high-frequency alternative, liquid crystal polymers (LCPs) have been widely investigated for use in circuit devices, chip integration, and module packaging over the last decade due to their low loss tangent up to 1.8 THz and good hermeticity. The previous review articles have summarized the chemical properties of LCP films, flexible LCP antennas, and LCP-based antenna-in-package and system-in-package technologies for 5G applications, although these articles did not discuss synthetic LCP technologies. In addition to wireless applications, the attractive mechanical, chemical, and thermal properties of LCP films enable interesting applications in micro-electro-mechanical systems (MEMS), biomedical electronics, and microfluidics, which have not been summarized to date. Here, a comprehensive review of flexible LCP technologies covering electric circuits, antennas, integration and packaging technologies, front-end modules, MEMS, biomedical devices, and microfluidics from microwave to THz frequencies is presented for the first time, which gives a broad introduction for those outside or just entering the field and provides perspective and breadth for those who are well established in the field.

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“…Printing electronics represent one of the major enabling technologies for IoT (Internet of Things) and will gain a dramatic increase in total market sales in the upcoming decade [62]. In the area of high-frequency, flexible and organic electronics, AM techniques have been extensively employed, and a number of related devices have been developed, such as the production of radio-frequency circuits [63]- [65], digitalto-analogue converters (DAC) [66], and all-inkjet organic inverter circuits [ tronic circuit boards. The main reason is also the relatively low conductivity of printed conductive traces compared with conventional PCBs.…”

Section: B Electric Circuitsmentioning

confidence: 99%

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

Zhang

Yuan

2022

IEEE J. Emerg. Sel. Topics Power Electron.

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Additive manufacturing techniques have by far been utilised to make 3D passive components (i.e. resistors, inductors, and capacitors), circuit boards and packages of power electronic devices. This paper provides an overview of automatic assembling technologies and additive manufacturing applications in power converters, as well as the advantages and limitations of each additive manufacturing process in this area. It shows that direct metal laser sintering offers advantages for manufacturing inductors with the conductivity of 68% of the International Annealed Copper Standard (IACS) and magnetic cores with the permeability greater than 10000 at 50 Hz. The additive electronics from Nano Dimension show great promise for fabricating power converter PCBs with the conductivity from 25% to 50% IACS. Additive manufacturing in thermal management and packaging has been extensively studied and will spark more changes in these fields. Besides, the potential of the combination of automated and additive manufacturing in power electronic systems has also been discussed, which sets the basis for future development of advanced manufacturing of power electronics.

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Aerosol-Printed Highly Conductive Ag Transmission Lines for Flexible Electronic Devices

Cited by 31 publications

References 31 publications

Screen-Printable Flexible Textile-Based Ultra-Broadband Millimeter-Wave DC-Blocking Transmission Lines Based on Microstrip-Embedded Printed Capacitors

Screen-Printable Flexible Textile-Based Ultra-Broadband Millimeter-Wave DC-Blocking Transmission Lines Based on Microstrip-Embedded Printed Capacitors

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters

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