Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration

Elmogi, Ahmed; Soenen, Wouter; Ramon, Hannes; Yin, Xin; Missinne, Jeroen; Spiga, Silvia; Amann, Markus‐Christian; Srinivasan, Ashwyn; Heyn, Peter De; Campenhout, Joris Van; Bauwelinck, Johan; Steenberge, Geert Van

doi:10.1109/jlt.2018.2848699

Cited by 9 publications

(5 citation statements)

References 19 publications

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“…Among the existing printing methods, aerosol jet printing is the most promising technology because it allows the formation of functional elements with a minimum lateral size of up to 10 microns [7][8][9] both on flat and curved substrates [10,11]. This technology has been applied for the manufacture of transistors [12], sensors [13][14][15], solar cells [16], microheaters [17], microantennas [18,19] and interconnects [20]. Previous studies of this technology relied mainly on the formation of thin-film microstructures due to the need for the manufacture of planar electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Aerosol Jet Printing of Silver Lines with A High Aspect Ratio on A Heated Silicon Substrate

et al. 2020

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In this work, we studied the formation of conductive silver lines with high aspect ratios (AR = thickness/width) > 0.1 using the modernized method of aerosol jet printing on a heated silicon substrate. The geometric (AR) and electrical (resistivity) parameters of the formed lines were investigated depending on the number of printing layers (1–10 layers) and the temperature of the substrate (25–300 °C). The AR of the lines increased as the number of printing layers and the temperature of the substrate increased. An increase in the AR of the lines with increasing substrate temperature was associated with a decrease in the ink spreading as a result of an increase in the rate of evaporation of nano-ink. Moreover, with an increase in the substrate temperature of more than 200 °C, a significant increase in the porosity of the formed lines was observed, and as a result, the electrical resistivity of the lines increased significantly. Taking into account the revealed regularities, it was demonstrated that the formation of silver lines with a high AR > 0.1 and a low electrical resistivity of 2–3 μΩ∙cm is advisable to be carried out at a substrate temperature of about 100 °C. The adhesion strength of silver films formed on a heated silicon substrate is 2.8 ± 0.9 N/mm2, which further confirms the suitability of the investigated method of aerosol jet printing for electronic applications.

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Section: Introductionmentioning

confidence: 99%

Aerosol Jet Printing of Silver Lines with A High Aspect Ratio on A Heated Silicon Substrate

et al. 2020

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“…The Ag ink from Clariant has a sheet resistance of 0.024 Ω/Square and the Au ink from UTDots has a sheet resistance of 0.129 Ω/Square. Both inks have been demonstrated in printed FHE devices such as strain gauges, capacitor electrodes, interconnects and coplanar waveguide (CPW) lines [13][14][15][16][17]. An Optomec AJ300 aerosol jet printer was used for this work.…”

Section: Sample Fabricationmentioning

confidence: 99%

Space survivability for printed electronics applications

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et al. 2021

Flex. Print. Electron.

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The effects of atomic oxygen (AO) in low earth orbit and the physical effects of space launch on printed materials were studied for aerosol-jet printed Au and Ag through a 6 month exposure period on the Materials International Space Station Experiment (MISSE). RF and DC test platforms were designed for two printed electronics-compatible substrates (Rogers CLTE-XT and Ferro L8) to assess the amount of degradation caused by AO exposure in space. A passivation layer of CORIN-XLS applied over the printed metal traces was also studied for its effectiveness. Both bare and passivated test structures of printed Ag and Au traces were exposed to low earth orbit on the 10th MISSE mission. The effects of AO and the 6 month space exposure on the samples are reported here.

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“…[11,12] Uniquely, these tools use both pneumatic and ultrasonic atomization to generate a fine mist (i.e., <5 μm droplet diameter) from precursor inks and digitally pattern them through a highly collimated beam. Accordingly, this technology has been used to pattern conductive tracks for a wide range of applications, including strain sensing, [13][14][15] on-chip interconnects for electronic packaging, [16][17][18] and printed transistors, [19,20] for increased densification of electronic subsystems and their incorporation into nonplanar form factors.…”

Section: Introductionmentioning

confidence: 99%

Electroplating of Aerosol Jet‐Printed Silver Inks

et al. 2021

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Aerosol jet printing of silver inks is a promising approach for 3D printing of electronics, particularly for obtaining very complex circuits with high‐resolution conductive pads and traces. Common silver inks are however not competitive with traditional bulk metal conductors, requiring sintering at high temperatures as well as having significant porosity that can result in early failure. Herein, the possibility of using electroplating to deposit bulk metal copper on aerosol jetted inks is investigated, and more than an order of magnitude reduction in electrical resistivity is shown. The plating rate, resistivity, and adhesion are characterized, along with the morphology of the resulting deposits. This approach is then shown to allow high‐strength soldering to the electroplated metal traces, demonstrating the capability of this technology for integration of soldered surface mount components with aerosol jet‐printed electronics.

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Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration

Cited by 9 publications

References 19 publications

Aerosol Jet Printing of Silver Lines with A High Aspect Ratio on A Heated Silicon Substrate

Aerosol Jet Printing of Silver Lines with A High Aspect Ratio on A Heated Silicon Substrate

Space survivability for printed electronics applications

Electroplating of Aerosol Jet‐Printed Silver Inks

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