2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference 2010
DOI: 10.1109/impact.2010.5699486
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Advantage of non-etching adhesion promoter on high frequency signal loss

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Cited by 3 publications
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“…Nevertheless, the principle is simple and consists of texturing the surface with simultaneous adsorption of a robust passivation layer. However, the roughening nature of the process will eventually be rendered obsolete in the production of future PCBs [41].…”
Section: Manufacturing Of Copper/epoxy Jointsmentioning
confidence: 99%
“…Nevertheless, the principle is simple and consists of texturing the surface with simultaneous adsorption of a robust passivation layer. However, the roughening nature of the process will eventually be rendered obsolete in the production of future PCBs [41].…”
Section: Manufacturing Of Copper/epoxy Jointsmentioning
confidence: 99%
“…The signal transmission loss of PCB is strongly linked to the impedance, induced by multiple factors such as dielectric constant, line width, line space and dielectric layer thickness, etc, since they could change the surface structure of copper and other substrate material [4][5][6]. PCB with high-precision impedance also show a lower chance on signal loss [7,8]. With a rapid development of high-speed big data transmission, there is an increasing requirement of quality control of high-frequency PCB products, especially their differential impedance control.…”
Section: Introductionmentioning
confidence: 99%