Advantage of non-etching adhesion promoter on high frequency signal loss

Zee, A.; Massey, Roger

doi:10.1109/impact.2010.5699486

Cited by 3 publications

(2 citation statements)

References 3 publications

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“…Nevertheless, the principle is simple and consists of texturing the surface with simultaneous adsorption of a robust passivation layer. However, the roughening nature of the process will eventually be rendered obsolete in the production of future PCBs [41].…”

Section: Manufacturing Of Copper/epoxy Jointsmentioning

confidence: 99%

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

2019

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Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

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Section: Manufacturing Of Copper/epoxy Jointsmentioning

confidence: 99%

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

2019

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“…The signal transmission loss of PCB is strongly linked to the impedance, induced by multiple factors such as dielectric constant, line width, line space and dielectric layer thickness, etc, since they could change the surface structure of copper and other substrate material [4][5][6]. PCB with high-precision impedance also show a lower chance on signal loss [7,8]. With a rapid development of high-speed big data transmission, there is an increasing requirement of quality control of high-frequency PCB products, especially their differential impedance control.…”

Section: Introductionmentioning

confidence: 99%